Layers : 6L
Thickness : 1.2mm
Out Layer Copper Thickness : H OZ
Inner Layer Copper Thickness : H OZ
Min hole size :0.1mm
Min Line Width/Space : 3mil
Surface finish : ENIG
Application :Screen display/ Consumer electronics
Features : High Density Interconnection + impedance matching
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WellCircuits ADVANTAGES
- In-house engineering
- Turnkey FPC & Assembly Solution
- Quick-turn up to 48hrs
- In-house assembly lines
- Support Prototype | Series Production