IQC Incoming Inspection
1. Measure the thickness of PCB.
2. Check whether the through-holes of the PCB and ink are blocked.
3. Inspect for warping, deformation, and ensure clear silkscreen.
4. Look for defects like broken wires and jumpers.
5. Conduct a reflow soldering furnace temperature test on the PCB to check for discoloration or deformation.
6. Verify the batch number, part number, and silkscreen against the BOM for incoming electronic components.
7. Perform pad or through-hole adaptation tests by placing incoming electronic components on bare PCB boards.
8. Sample check the resistance and capacitance of incoming electronic components and compare them with the BOM.
9. Inspect incoming electronic components for scratches, deformations, broken feet, short feet, etc.
Component Storage and Solder Paste Printing
10. Store sensitive components in a professional constant temperature and humidity box.
11. For strict PCB/IC/BGA requirements, bake for 48-72 hours to remove surface moisture and enhance solderability.
12. Utilize first-line brand solder paste.
13. Employ high-quality laser steel mesh.
14. Follow complete solder paste freezing, thawing, and mixing procedures.
15. Utilize fully automatic solder paste printers to ensure consistency and reliability during mass production.
SMT Chip Processing
16. Utilize Samsung SM471/481/482 series high-speed automatic SMT placement machines with 01005 accuracy.
17. Employ electric feeders to reduce throwing rate and failure warning probability.
18. Support mainstream chip types including QFN, SOP, SOT, TSOP, QFP, BGA, PLCC.
19. Maximize single machine capacity of SM471 to 75,000 pieces per hour.
20. Utilize 20 temperature zone reflow soldering, adhering to qualified furnace temperature curves.
21. Monitor furnace temperature every 4 hours using a furnace temperature tester.
22. Batch detect wrong parts, missing parts, reverse, false welding, and other defects using AOI optical detectors.
23. Utilize x-Ray to inspect boards with dense ball BGAs.
DIP Plug-in Processing
24. Follow strict work instructions.
25. Develop wave soldering jigs for mass production to ensure soldering reliability and consistency.
26. Use well-known brand wave soldering equipment.
27. Equip 2 plug-in production lines to meet mass production needs.
28. Develop test racks according to customer requirements in the engineering department, capable of programming and functional testing of mainstream chips.
1. Measure the thickness of PCB.
2. Check whether the through-holes of the PCB and ink are blocked.
3. Inspect for warping, deformation, and ensure clear silkscreen.
4. Look for defects like broken wires and jumpers.
5. Conduct a reflow soldering furnace temperature test on the PCB to check for discoloration or deformation.
6. Verify the batch number, part number, and silkscreen against the BOM for incoming electronic components.
7. Perform pad or through-hole adaptation tests by placing incoming electronic components on bare PCB boards.
8. Sample check the resistance and capacitance of incoming electronic components and compare them with the BOM.
9. Inspect incoming electronic components for scratches, deformations, broken feet, short feet, etc.
Component Storage and Solder Paste Printing
10. Store sensitive components in a professional constant temperature and humidity box.
11. For strict PCB/IC/BGA requirements, bake for 48-72 hours to remove surface moisture and enhance solderability.
12. Utilize first-line brand solder paste.
13. Employ high-quality laser steel mesh.
14. Follow complete solder paste freezing, thawing, and mixing procedures.
15. Utilize fully automatic solder paste printers to ensure consistency and reliability during mass production.
SMT Chip Processing
16. Utilize Samsung SM471/481/482 series high-speed automatic SMT placement machines with 01005 accuracy.
17. Employ electric feeders to reduce throwing rate and failure warning probability.
18. Support mainstream chip types including QFN, SOP, SOT, TSOP, QFP, BGA, PLCC.
19. Maximize single machine capacity of SM471 to 75,000 pieces per hour.
20. Utilize 20 temperature zone reflow soldering, adhering to qualified furnace temperature curves.
21. Monitor furnace temperature every 4 hours using a furnace temperature tester.
22. Batch detect wrong parts, missing parts, reverse, false welding, and other defects using AOI optical detectors.
23. Utilize x-Ray to inspect boards with dense ball BGAs.
DIP Plug-in Processing
24. Follow strict work instructions.
25. Develop wave soldering jigs for mass production to ensure soldering reliability and consistency.
26. Use well-known brand wave soldering equipment.
27. Equip 2 plug-in production lines to meet mass production needs.
28. Develop test racks according to customer requirements in the engineering department, capable of programming and functional testing of mainstream chips.
