How to ensure the quality of solder joints has become a critical issue for high-precision PCB assembly, especially with dense component placement. Solder joints act as the connection bridges for components, and their quality and reliability directly impact the overall performance of electronic devices. In other words, the quality of SMT (Surface-Mount Technology) assembly is ultimately reflected in the quality of the solder joints.
1. **Identification of PCB Cold Soldering**
1.1. Use specialized online testing equipment for detection.
1.2. Perform visual inspection or AOI (Automated Optical Inspection). If you observe issues such as insufficient solder, poor solder penetration, cracks in the center of the joint, convex or spherical solder surfaces, or a lack of proper solder bonding to the SMD (Surface-Mounted Device), these are signs of potential problems. Even minor issues can lead to hidden risks, so it’s essential to evaluate whether there are instances of cold soldering. The method for assessment involves checking if the same issue appears at multiple locations on the PCB. For example, if a specific problem is observed on several boards, it could be due to issues like paste contamination, pin deformation, or similar causes. If multiple PCBs exhibit the same fault at the same location, it is likely due to a defective component or a problem with the pad design.
Second, the cause and solution of PCB virtual soldering
1. **Defective pad design.** The presence of through-holes in pads is a significant disadvantage in PCB design. Unless absolutely necessary, through-holes should be avoided. These holes can lead to solder loss and insufficient soldering material. The spacing and area of the pads must also be standardized; otherwise, design adjustments should be made promptly.
2. **Oxidation of the PCB.** If the pad turns black and loses its shine, it indicates oxidation. In this case, an eraser can be used to remove the oxide layer and restore its brightness. If the PCB is damp, it can be dried in a drying oven. Additionally, if the board has oil or sweat stains, they should be cleaned with absolute ethanol.
3. **Solder paste depletion.** On PCBs that have been printed with solder paste, excessive scraping or rubbing can reduce the amount of paste on the pads, leading to insufficient solder material. Additional solder paste should be applied immediately. This can be done with a dispenser or by using a bamboo stick to apply a small amount.
### PCB Demand Growth and Future Focus Areas
The demand for PCBs is growing rapidly, with a particular focus on high-end HDI and packaging substrates.
The server PCB market continues to expand, with substantial future revenue potential for communication board manufacturers. Attention should be given to PCB technologies used in 5G base stations and terminals.
The electrification and intelligence of automobiles provide new growth opportunities in the automotive PCB market. In 2018, the output value of automotive PCBs was $7.6 billion. It is projected that by 2023, the global automotive PCB market will reach $10.171 billion, with a compound annual average growth rate (CAAGR) of 6%. Specifically, the output value for traditional fuel vehicle PCBs is expected to decrease to $4.149 billion by 2023, with a CAAGR of -5%. In contrast, the output value for automotive electrification PCBs will rise to $5.437 billion, with a CAAGR of 23.61%. Additionally, the demand for PCBs in automotive intelligent networking will reach $5.85 billion, with a CAAGR of 10.54%. The production threshold for safety-critical automotive PCBs is relatively high, and domestic competition is limited, creating significant profit potential for manufacturers.
In recent years, consumer electronics have continued to innovate, opening new growth avenues for consumer electronics PCBs. According to Prismark, the value of PCBs in consumer electronics was $24.171 billion in 2018, and it is expected to reach $28.87 billion by 2022, with a CAAGR of 4.2%. Within this segment, the smart wearable device market has experienced explosive growth, with shipments rising from 135 million units in 2018 to an estimated 205 million units in 2023, reflecting a CAAGR of 23%. This surge is driving increased demand for flexible printed circuits (FPCs). Moreover, 5G technology will serve as a new growth driver for smartphones. It is projected that 5G smartphone shipments will reach 725 million units in 2023, boosting demand for high-end PCBs, such as SLP and advanced HDI boards. Manufacturers focusing on FPCs, SLP, and high-end HDI are expected to see new growth opportunities. Leading domestic FPC manufacturers, as well as PCB electronics companies with the capability for low-volume, high-end HDI mass production, are well-positioned for future success.
Currently, China’s PCB industry primarily focuses on low-end products, but there is strong potential for domestic substitution in the high-end market. The outlook for high-end PCB manufacturers is promising.
The global high-end PCB market is largely dominated by overseas companies, but due to trade tensions and the strong demand from China’s independent electronics brands, the prospects for China’s high-end PCB manufacturers are increasingly favorable. By expanding financing channels, investing in production research and development, and continuing to scale up production capacity, leading domestic PCB companies are poised to capture a growing share of the global high-end PCB market.
If you have any PCB manufacturing needs, please do not hesitate to contact me.Contact me
1. **Identification of PCB Cold Soldering**
1.1. Use specialized online testing equipment for detection.
1.2. Perform visual inspection or AOI (Automated Optical Inspection). If you observe issues such as insufficient solder, poor solder penetration, cracks in the center of the joint, convex or spherical solder surfaces, or a lack of proper solder bonding to the SMD (Surface-Mounted Device), these are signs of potential problems. Even minor issues can lead to hidden risks, so it’s essential to evaluate whether there are instances of cold soldering. The method for assessment involves checking if the same issue appears at multiple locations on the PCB. For example, if a specific problem is observed on several boards, it could be due to issues like paste contamination, pin deformation, or similar causes. If multiple PCBs exhibit the same fault at the same location, it is likely due to a defective component or a problem with the pad design.
Second, the cause and solution of PCB virtual soldering
1. **Defective pad design.** The presence of through-holes in pads is a significant disadvantage in PCB design. Unless absolutely necessary, through-holes should be avoided. These holes can lead to solder loss and insufficient soldering material. The spacing and area of the pads must also be standardized; otherwise, design adjustments should be made promptly.
2. **Oxidation of the PCB.** If the pad turns black and loses its shine, it indicates oxidation. In this case, an eraser can be used to remove the oxide layer and restore its brightness. If the PCB is damp, it can be dried in a drying oven. Additionally, if the board has oil or sweat stains, they should be cleaned with absolute ethanol.
3. **Solder paste depletion.** On PCBs that have been printed with solder paste, excessive scraping or rubbing can reduce the amount of paste on the pads, leading to insufficient solder material. Additional solder paste should be applied immediately. This can be done with a dispenser or by using a bamboo stick to apply a small amount.
### PCB Demand Growth and Future Focus Areas
The demand for PCBs is growing rapidly, with a particular focus on high-end HDI and packaging substrates.
The server PCB market continues to expand, with substantial future revenue potential for communication board manufacturers. Attention should be given to PCB technologies used in 5G base stations and terminals.
The electrification and intelligence of automobiles provide new growth opportunities in the automotive PCB market. In 2018, the output value of automotive PCBs was $7.6 billion. It is projected that by 2023, the global automotive PCB market will reach $10.171 billion, with a compound annual average growth rate (CAAGR) of 6%. Specifically, the output value for traditional fuel vehicle PCBs is expected to decrease to $4.149 billion by 2023, with a CAAGR of -5%. In contrast, the output value for automotive electrification PCBs will rise to $5.437 billion, with a CAAGR of 23.61%. Additionally, the demand for PCBs in automotive intelligent networking will reach $5.85 billion, with a CAAGR of 10.54%. The production threshold for safety-critical automotive PCBs is relatively high, and domestic competition is limited, creating significant profit potential for manufacturers.
In recent years, consumer electronics have continued to innovate, opening new growth avenues for consumer electronics PCBs. According to Prismark, the value of PCBs in consumer electronics was $24.171 billion in 2018, and it is expected to reach $28.87 billion by 2022, with a CAAGR of 4.2%. Within this segment, the smart wearable device market has experienced explosive growth, with shipments rising from 135 million units in 2018 to an estimated 205 million units in 2023, reflecting a CAAGR of 23%. This surge is driving increased demand for flexible printed circuits (FPCs). Moreover, 5G technology will serve as a new growth driver for smartphones. It is projected that 5G smartphone shipments will reach 725 million units in 2023, boosting demand for high-end PCBs, such as SLP and advanced HDI boards. Manufacturers focusing on FPCs, SLP, and high-end HDI are expected to see new growth opportunities. Leading domestic FPC manufacturers, as well as PCB electronics companies with the capability for low-volume, high-end HDI mass production, are well-positioned for future success.
Currently, China’s PCB industry primarily focuses on low-end products, but there is strong potential for domestic substitution in the high-end market. The outlook for high-end PCB manufacturers is promising.
The global high-end PCB market is largely dominated by overseas companies, but due to trade tensions and the strong demand from China’s independent electronics brands, the prospects for China’s high-end PCB manufacturers are increasingly favorable. By expanding financing channels, investing in production research and development, and continuing to scale up production capacity, leading domestic PCB companies are poised to capture a growing share of the global high-end PCB market.
If you have any PCB manufacturing needs, please do not hesitate to contact me.Contact me
