1. PCB manufacturing consists of PCB fabrication and PCB assembly. In most cases, rigid-flex PCBs don’t have large or even mid-volume orders like rigid PCBs, making it less cost-effective and efficient to hire a separate assembler. By collaborating with a fabricator offering turnkey assembly services, you can expedite delivery and reduce communication costs caused by multiple vendors. Since some firms specialize in only one service and not the other, when selecting a fabricator, it’s advisable to confirm whether they provide assembly services as well.

2. Another crucial aspect to consider is their capability. Beyond a brief introduction to their offerings, seek detailed descriptions of key parameters such as final thickness, impedance control, minimum trace/width, copper thickness, aspect ratio, minimum hole size, and available laminates. These specifics aid in assessing their proficiency in building rigid-flex PCBs. If concerned about exaggeration, select a few parameters and request past cases for reference. After documenting these details, delve deeper into verifying their capacity for volume production. Many manufacturers can only deliver a few rigid-flex PCB samples after scrapping numerous boards. Entrusting them with your volume order, even a small run, could lead to disaster.

1. The last consideration is communication. This aspect is highlighted because I assume you are seeking a Chinese rigid-flex PCB manufacturer, which may present challenges due to time-zone and language differences. PCB projects typically involve numerous updates and revisions, hence requiring extra attention to communication when selecting a supplier. This aspect can be easily assessed during email correspondence or phone conversations.

In summary, when initiating contact with a new rigid-flex PCB supplier, inquire about the following:

1. Though the list above is not exhaustive, incorporating these elements can provide a solid foundation for initiating inquiries with potential rigid flex PCB suppliers.

1. Featuring 0.1mm buried microvias and a super-thin 0.8mm final thickness to achieve optimal interconnectivity and exceptional bending performance.

1. Featuring a 6-layer configuration and a 2-tier HDI design to ensure exceptional reliability in demanding environments.

1. Featuring an 8-layer count and HDI design to achieve higher circuitry density.