1. Why Add Test Points to Circuit Board Design?
2. Circuit board design and test points are not initially required in PCB production. However, following PCBA completion, In-Circuit Test (ICT) is conducted to assess soldering integrity and overall performance compliance.
3. Throughout PCB production, testing for circuit continuity, specifically to identify open or short circuits, is imperative. Test points serve as contact points for diverse network assessments.
4. While bare PCBs pose minimal issues, post-assembly, especially with SMT components, using a needle bed for testing risks damaging delicate components.
5. To mitigate such risks, integrating test points along each network line is essential to accommodate the needle bed without compromising SMT component integrity. This ensures accurate testing without component damage.
6. Historically, guidelines recommended adding test points to 90% of networks. However, challenges arise with needle bed testing, including needle size limitations and spacing constraints, particularly on high-density circuit boards.
7. Given space limitations on densely packed circuit boards, incorporating numerous test points becomes impractical. Alternative testing methods, such as JTAG, X-Ray, and AOI, offer viable alternatives but may not entirely replace ICT testing in certain scenarios.
8. The PCB design service process adapts accordingly to ensure comprehensive testing strategies are implemented.
2. Circuit board design and test points are not initially required in PCB production. However, following PCBA completion, In-Circuit Test (ICT) is conducted to assess soldering integrity and overall performance compliance.
3. Throughout PCB production, testing for circuit continuity, specifically to identify open or short circuits, is imperative. Test points serve as contact points for diverse network assessments.
4. While bare PCBs pose minimal issues, post-assembly, especially with SMT components, using a needle bed for testing risks damaging delicate components.
5. To mitigate such risks, integrating test points along each network line is essential to accommodate the needle bed without compromising SMT component integrity. This ensures accurate testing without component damage.
6. Historically, guidelines recommended adding test points to 90% of networks. However, challenges arise with needle bed testing, including needle size limitations and spacing constraints, particularly on high-density circuit boards.
7. Given space limitations on densely packed circuit boards, incorporating numerous test points becomes impractical. Alternative testing methods, such as JTAG, X-Ray, and AOI, offer viable alternatives but may not entirely replace ICT testing in certain scenarios.
8. The PCB design service process adapts accordingly to ensure comprehensive testing strategies are implemented.
