Common Causes of PCB Explosions and Solutions
- The survey reveals that PCB explosions are a prevalent issue in electronics manufacturing, often stemming from quality and reliability concerns.
- During the soldering process, elevated temperatures can increase the risk of explosions, with insufficient heat resistance of the substrate being a primary cause.
- Factors contributing to copper-clad laminate explosions include inadequate substrate curing, which reduces heat resistance and elevates the risk during PCB processing.
Addressing PCB Failures
When encountering board failures, users can investigate and resolve issues from the following perspectives:
- Moisture Absorption: Improper storage of the substrate may lead to moisture absorption, causing board delamination. Repackaging unused laminates and proper handling can minimize this risk.
- Low Tg Substrate: Using laminates with low Tg for high-heat applications can result in delamination. Ensuring proper curing and considering higher Tg materials can mitigate this issue.
- Ink Impact: Thick ink on marking materials can reduce copper foil adhesion, leading to board failures. Ensuring ink compatibility is crucial.
The PCB production process is largely automated, but challenges can arise. Strict quality control is essential to produce reliable PCBs. If you require PCB manufacturing services, feel free to contact us.
