1. In 1936, Austrian Paul Eisler first utilized printed circuit boards in radios.
2. By 1943, Americans predominantly adopted this technology for military radios.
3. In 1948, the United States officially approved this invention for commercial use.
4. It was not until the mid-1950s that printed circuit boards began to see widespread adoption.
5. Before the advent of PCBs, electronic components were interconnected directly by wires.
6. Today, wires are primarily used in laboratories for test applications, as printed circuit boards have become the dominant technology in the electronics industry.
7. To increase the wiring area, multilayer boards employ multiple single- and double-sided layers.
8. A common configuration is one double-sided layer as the inner layer, with two single-sided layers as the outer layers, or alternatively, two double-sided layers as the inner layers and two single-sided layers as the outer layers.
9. The layers are alternately positioned with insulating bonding materials, and the conductive patterns are arranged according to design specifications, resulting in four-layer and six-layer printed circuit boards, collectively known as multilayer printed circuit boards.
1. Copper clad laminate is a substrate material used for manufacturing printed circuit boards (PCBs). It supports various components and can achieve either electrical connections or electrical insulation between them.
2. From the early 20th century until the end of the 1940s, a wide range of resins, reinforcing materials, and insulating substrates for circuit boards emerged, along with preliminary technological advancements. These developments laid the groundwork for the advent and evolution of copper clad laminates, the most common substrate material for PCBs. Concurrently, PCB manufacturing technology, which initially focused on metal foil etching (a subtractive method), began to establish itself, playing a crucial role in determining the structural composition and characteristics of copper clad laminates.
3. In PCB manufacturing, lamination, also known as “pressing,” involves combining the inner monolithic layers, prepregs, and copper foils through high-temperature pressing to create a multilayer board. For instance, a four-layer board consists of a single inner layer, two copper foils, and two sets of prepregs that are pressed together.
4. The drilling process for multilayer PCBs is typically carried out in stages, divided into one drill and two drills. The first drill involves a copper immersion process, where the drilled holes are plated with copper to connect the upper and lower layers, such as vias and original holes.
5. The second-drilled holes do not require copper plating and include features like screw holes, positioning holes, and heat sinks. These holes do not need copper plating within their inner pockets.
6. The film used in PCB manufacturing is the exposed negative. The PCB surface is coated with a photosensitive liquid, dried after a temperature test at 80 degrees Celsius, and then covered with film. After exposure to ultraviolet light, the film is removed, revealing the circuit pattern on the PCB.
7. Green oil, or solder mask, refers to the ink applied to the copper foil on the PCB. This ink covers all conductive areas except for the soldering pads. It prevents soldering short circuits during use and extends the PCB’s lifespan. Solder masks come in various colors, including green, black, red, blue, yellow, and white, with green being the most commonly used.
8. The plane of a computer motherboard is a PCB, typically a four-layer or six-layer board. To reduce costs, low-end motherboards are often four-layer boards comprising a main signal layer, a ground layer, a power layer, and a secondary signal layer. A six-layer board includes an additional power layer and a middle signal layer, making it more resistant to electromagnetic interference and resulting in a more stable motherboard.
2. By 1943, Americans predominantly adopted this technology for military radios.
3. In 1948, the United States officially approved this invention for commercial use.
4. It was not until the mid-1950s that printed circuit boards began to see widespread adoption.
5. Before the advent of PCBs, electronic components were interconnected directly by wires.
6. Today, wires are primarily used in laboratories for test applications, as printed circuit boards have become the dominant technology in the electronics industry.
7. To increase the wiring area, multilayer boards employ multiple single- and double-sided layers.
8. A common configuration is one double-sided layer as the inner layer, with two single-sided layers as the outer layers, or alternatively, two double-sided layers as the inner layers and two single-sided layers as the outer layers.
9. The layers are alternately positioned with insulating bonding materials, and the conductive patterns are arranged according to design specifications, resulting in four-layer and six-layer printed circuit boards, collectively known as multilayer printed circuit boards.
1. Copper clad laminate is a substrate material used for manufacturing printed circuit boards (PCBs). It supports various components and can achieve either electrical connections or electrical insulation between them.
2. From the early 20th century until the end of the 1940s, a wide range of resins, reinforcing materials, and insulating substrates for circuit boards emerged, along with preliminary technological advancements. These developments laid the groundwork for the advent and evolution of copper clad laminates, the most common substrate material for PCBs. Concurrently, PCB manufacturing technology, which initially focused on metal foil etching (a subtractive method), began to establish itself, playing a crucial role in determining the structural composition and characteristics of copper clad laminates.
3. In PCB manufacturing, lamination, also known as “pressing,” involves combining the inner monolithic layers, prepregs, and copper foils through high-temperature pressing to create a multilayer board. For instance, a four-layer board consists of a single inner layer, two copper foils, and two sets of prepregs that are pressed together.
4. The drilling process for multilayer PCBs is typically carried out in stages, divided into one drill and two drills. The first drill involves a copper immersion process, where the drilled holes are plated with copper to connect the upper and lower layers, such as vias and original holes.
5. The second-drilled holes do not require copper plating and include features like screw holes, positioning holes, and heat sinks. These holes do not need copper plating within their inner pockets.
6. The film used in PCB manufacturing is the exposed negative. The PCB surface is coated with a photosensitive liquid, dried after a temperature test at 80 degrees Celsius, and then covered with film. After exposure to ultraviolet light, the film is removed, revealing the circuit pattern on the PCB.
7. Green oil, or solder mask, refers to the ink applied to the copper foil on the PCB. This ink covers all conductive areas except for the soldering pads. It prevents soldering short circuits during use and extends the PCB’s lifespan. Solder masks come in various colors, including green, black, red, blue, yellow, and white, with green being the most commonly used.
8. The plane of a computer motherboard is a PCB, typically a four-layer or six-layer board. To reduce costs, low-end motherboards are often four-layer boards comprising a main signal layer, a ground layer, a power layer, and a secondary signal layer. A six-layer board includes an additional power layer and a middle signal layer, making it more resistant to electromagnetic interference and resulting in a more stable motherboard.
