1. The main purpose of PCBA surface mount processing is to accurately install surface mount components in fixed positions on the PCB. However, during the surface mount processing, there may be some process issues that affect the mounting quality, such as component displacement.

2. The displacement of components during surface mount processing is a precursor to several other issues during the soldering process of component boards, and should be taken seriously.

3. So, what are the reasons for component displacement during SMT processing?

4. The reasons for the displacement of components in surface mount processing include: the limited use time of solder paste, after exceeding its service life, the internal flux will deteriorate, and the soldering effect will be poor.

5. The viscosity of the solder paste itself is insufficient, causing displacement of the components during transportation due to vibration and shaking.

6. Excessive flux content in solder paste leads to excessive flux flow during reflow soldering, resulting in component displacement。