1. The flexible circuit board is a highly reliable and advanced flexible printed circuit board, made from polyimide or polyester film as the base material.
2. Often referred to as a soft board or FPC, it is characterized by its lightweight, compact size, and the ability to fold and bend.
3. Not only does it offer excellent insulation, sealing properties, radiation resistance, and high-temperature tolerance, but it also provides outstanding solderability, ease of assembly, and high-speed electrical transmission characteristics.
4. With advancements in process design, high-density SMT (Surface Mount Technology) can now be applied to FPCs.
5. However, due to the inherently flexible nature of FPCs, the reliability of chip ICs and components tends to be lower than that of traditional PCBs.
6. As a result, component dispensing and reinforcement have become the preferred method for enhancing the reliability of these boards in many manufacturing applications.
More and more FPC soft board manufacturers are receiving customer orders for dispensing and reinforcement, and many of them initially struggle with how to approach it. In fact, this process is not as complicated as it may seem. The first step is to choose the right dispenser. Well-known international brands of dispensers include Musashi, EFD, Feishen, Asymtek, CAMALOT, Sejong, South Korea’s Alpa, IEI, and LILE. Domestic brands include AXXON Axis, Dongguan Anda, Shenzhen Huahaida, and others. Dispensers come in various types, including controller-based, desktop, semi-automatic, and fully automatic models. The prices of these machines vary significantly depending on their level of automation. Each factory should select the appropriate model based on its production capacity, personnel, and order requirements.
Once the dispensing machine is selected, the next step is to choose the right adhesive. Typically, single-component epoxy resin glue is used for this purpose. Epoxy resin is a fluid liquid that does not cure on its own, so a curing agent must be added. At room temperature, the curing agent does not react with the epoxy resin; the cross-linking reaction only occurs when heated to a certain temperature. This heat triggers the curing process, releasing energy that accelerates the curing of the glue. Once cured, epoxy resin glue offers high bonding strength, excellent resistance to high temperatures (200–250°C long-term, 400°C for short periods), and outstanding impact and vibration resistance. The cured product also exhibits excellent resistance to acids, alkalis, moisture, water, oil, and dust. It is durable against damp heat and atmospheric aging, while also offering good electrical properties such as insulation, compression resistance, and high bonding strength.
This adhesive should be stored in a cool environment and allowed to warm up for approximately 2 hours before use. Prior to bonding, it is important to clean the bonding surfaces with a suitable cleaning agent to improve adhesion.
The most common issues encountered in FPC IC reinforcement dispensing are bubbles and air pockets. Below are explanations of the causes and solutions for these problems:
1. There are two main methods for removing bubbles from epoxy resin: autonomous defoaming (using a defoaming agent) and passive defoaming (achieved by applying external forces such as grinding or vacuuming). Typically, a combination of both methods is used.
2. There are two types of bubbles commonly encountered: “needle” bubbles, which are small and lightweight (about the size of a sewing needle), and “air pits,” which are larger (approximately 1mm in size) and quite deep—sometimes even revealing the substrate or gold traces beneath. Typically, each glue point will only have one air pit.
If your have any questions about PCB ,please contact me info@wellcircuits.com
2. Often referred to as a soft board or FPC, it is characterized by its lightweight, compact size, and the ability to fold and bend.
3. Not only does it offer excellent insulation, sealing properties, radiation resistance, and high-temperature tolerance, but it also provides outstanding solderability, ease of assembly, and high-speed electrical transmission characteristics.
4. With advancements in process design, high-density SMT (Surface Mount Technology) can now be applied to FPCs.
5. However, due to the inherently flexible nature of FPCs, the reliability of chip ICs and components tends to be lower than that of traditional PCBs.
6. As a result, component dispensing and reinforcement have become the preferred method for enhancing the reliability of these boards in many manufacturing applications.
More and more FPC soft board manufacturers are receiving customer orders for dispensing and reinforcement, and many of them initially struggle with how to approach it. In fact, this process is not as complicated as it may seem. The first step is to choose the right dispenser. Well-known international brands of dispensers include Musashi, EFD, Feishen, Asymtek, CAMALOT, Sejong, South Korea’s Alpa, IEI, and LILE. Domestic brands include AXXON Axis, Dongguan Anda, Shenzhen Huahaida, and others. Dispensers come in various types, including controller-based, desktop, semi-automatic, and fully automatic models. The prices of these machines vary significantly depending on their level of automation. Each factory should select the appropriate model based on its production capacity, personnel, and order requirements.
Once the dispensing machine is selected, the next step is to choose the right adhesive. Typically, single-component epoxy resin glue is used for this purpose. Epoxy resin is a fluid liquid that does not cure on its own, so a curing agent must be added. At room temperature, the curing agent does not react with the epoxy resin; the cross-linking reaction only occurs when heated to a certain temperature. This heat triggers the curing process, releasing energy that accelerates the curing of the glue. Once cured, epoxy resin glue offers high bonding strength, excellent resistance to high temperatures (200–250°C long-term, 400°C for short periods), and outstanding impact and vibration resistance. The cured product also exhibits excellent resistance to acids, alkalis, moisture, water, oil, and dust. It is durable against damp heat and atmospheric aging, while also offering good electrical properties such as insulation, compression resistance, and high bonding strength.
This adhesive should be stored in a cool environment and allowed to warm up for approximately 2 hours before use. Prior to bonding, it is important to clean the bonding surfaces with a suitable cleaning agent to improve adhesion.
The most common issues encountered in FPC IC reinforcement dispensing are bubbles and air pockets. Below are explanations of the causes and solutions for these problems:
1. There are two main methods for removing bubbles from epoxy resin: autonomous defoaming (using a defoaming agent) and passive defoaming (achieved by applying external forces such as grinding or vacuuming). Typically, a combination of both methods is used.
2. There are two types of bubbles commonly encountered: “needle” bubbles, which are small and lightweight (about the size of a sewing needle), and “air pits,” which are larger (approximately 1mm in size) and quite deep—sometimes even revealing the substrate or gold traces beneath. Typically, each glue point will only have one air pit.
If your have any questions about PCB ,please contact me info@wellcircuits.com
