SMT chip processing production lines can be categorized based on the degree of automation and production line size. The degree of automation divides lines into fully automatic and semi-automatic production lines, while production line size categorizes them into large, medium, and small lines.
Automation Degree:

• Fully automatic production lines:
• Utilize entirely automated equipment.
• Employ automatic loading machines, buffer connection lines, and unloading machines to connect all production equipment into an automatic line.
• Semi-automatic production lines:
• Use partially linked or non-linked main production equipment.
• Require manual printing or manual loading and unloading of printed boards.
  Typical Stations:

1. Printing:

• Leaks solder paste or patch glue onto PCB pads.
• Utilizes a printing press (stencil printing press) located at the forefront of the SMT production line.

1. Dispensing:

• Drips glue onto fixed PCB positions to secure components.
• Utilizes a glue dispenser, located at the front end of the SMT production line or behind inspection equipment.

1. Mounting:

• Accurately installs surface-mounted components on fixed PCB positions.
• Utilizes a pick and place machine, located after the printing press in the SMT line.

1. Curing:

• Melts patch glue to firmly bond surface mount components and PCB together.
• Utilizes a curing oven, located behind the placement machine in the SMT production line.

1. Reflow Soldering:

• Melts solder paste to bond surface mount components and PCB together.
• Utilizes a reflow oven, located behind the placement machine in the SMT production line.

1. Cleaning:

• Removes harmful welding residues from assembled PCBs, such as flux.
• Utilizes a washing machine, with a flexible location placement either online or offline.

1. Inspection:

• Inspects welding and assembly quality of PCBs.
• Utilizes various testing equipment including magnifying glass, microscope, in-circuit tester (ICT), flying probe tester, automated optical inspection (AOI), X-ray inspection system, and functional tester. The location is flexible based on inspection needs.

1. Rework:

• Repairs PCBs with detected failures.
• Utilizes a soldering iron, commonly performed at a rework station.