This article serves as an introduction to the PCB circuit board design requirements for COB in the PCB circuit board process. Because COB eliminates the lead frame used in IC packaging, it relies entirely on the PCB circuit board. Consequently, the design of the solder pad on the PCB is crucial; only electroplated gold or ENIG can be utilized. Otherwise, connections with gold wire, aluminum cable, or even the latest copper cable may encounter issues.

**COB PCB Circuit Board Design Requirements**

1. The finished surface treatment of the PCB circuit board must be either electroplated gold or ENIG, and it should be thicker than the gold-plated layer typically found on standard PCBs to provide the necessary energy for die bonding, facilitating gold-aluminum or gold-gold connections.