What are the requirements for PCBA patch processing and SMT patch processing? The main points for consideration are as follows:
As electronic products evolve toward miniaturization, SMT components are becoming increasingly smaller, which raises the standards for the processing environment of these components. This trend places greater demands on SMT chip processing. An efficient SMT patch factory with robust quality control not only requires stringent process flow management but also needs to maintain a well-regulated environment in the SMT workshop, along with a clear understanding of essential precautions.
1. Environmental Requirements for the SMT Patch Processing Workshop
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SMT patch production equipment is a high-precision mechatronic system. The equipment and process materials have specific requirements regarding cleanliness, humidity, and temperature in the environment. To ensure the proper functioning of the equipment, minimize environmental damage to components, and enhance quality, the SMT workshop environment must meet the following criteria:
1. **Power**
Typically, single-phase AC220 (220±10%, 0/60Hz) and three-phase AC380 (380±10%, 50/60Hz) are required. The power supply should have a capacity that is more than double the actual power consumption.
2. **Exhaust**
Reflow soldering and wave soldering equipment must be fitted with exhaust fans. For all hot air furnaces, the minimum exhaust duct flow rate should be 500 cubic feet per minute (14.15m³/min).
3. **Temperature and Humidity**
The ambient temperature of the production workshop should be maintained at 23±3 degrees Celsius, typically ranging from 17 to 28 degrees Celsius, with relative humidity between 45% and 70% RH. Based on the workshop size, appropriate temperature and humidity meters should be installed for regular monitoring, along with facilities for adjusting temperature and humidity.
4. **Air Source**
The air source pressure should be configured according to the equipment’s requirements. Factory air can be utilized, or a separate oil-free compressed air machine may be installed. Generally, the pressure should exceed 7 kg/cm². Clean, dry, purified air is essential; therefore, the compressed air must undergo de-oiling, dust, and water treatment. Use stainless steel or pressure-resistant plastic pipes for air ducts.
5. **Anti-static**
Workers must wear anti-static clothing, shoes, and wrist straps when entering the workshop. The anti-static work area should be equipped with anti-static flooring, seat cushions, packaging bags, turnover boxes, and PCB racks.
**II. Important Considerations in SMT Patch Processing**
1. **Solder Paste Refrigeration**
When solder paste is newly purchased and not used immediately, it should be stored in a refrigerator. The ideal temperature is between 5 and 10 degrees Celsius, and it must not drop below 0 degrees Celsius. While there are many resources online discussing solder paste stirring and usage, we will not delve into those details here.
2. **Timely Replacement of Worn Parts in the Placement Machine**
During the placement process, wear and tear on the placement machine, including damage to the suction nozzle and feeder, can lead to misalignment and increased throw rates, thereby reducing production efficiency and raising costs. It’s crucial to regularly inspect the suction nozzle for blockages or damage, as well as ensure the feeder is in good condition.
3. **Measuring Furnace Temperature**
The quality of soldering PCB circuit boards is closely tied to the proper setting of process parameters in reflow soldering. Generally, furnace temperature tests should be conducted twice daily, with at least a daily minimum test to continually refine the temperature curve, establishing the optimal settings for the soldering products. Don’t overlook this step in the interest of production efficiency and cost savings.
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