The abbreviation FPC stands for Flexible Printed Circuit, also referred to as flexible circuit board, flexible PCB, or simply FPC. It is characterized by high wiring density, excellent flexibility, the ability to bend, lightweight construction, and thin thickness.
FPCs are primarily used in products such as laptops, mobile phones, LCMs, LCDs, PDAs, digital cameras, and many others.
**Features:**
Today’s flexible circuits (FPCs) are increasingly complex in shape and require faster turnaround times. Traditional flexible circuit processing methods, which involve machining techniques to create cover film windows and process the exterior, can no longer meet the demands of the market. These methods are cumbersome, costly for small to medium production runs, and the increasingly intricate shapes and sizes of openings make them difficult to process with molds. TopWin’s MicroVector equipment addresses these challenges by using high-power ultraviolet lasers for the processing of flexible circuit boards. This approach is suitable for both small batch and mass production, and has gained recognition in the market for its quality, cost-effectiveness, and speed.
1. Laser cutting directly from CAD data is more convenient and faster, significantly reducing delivery times.
2. By using a galvanometer scanner and a linear motor-driven two-dimensional worktable in combination, the system avoids added complexity from intricate shapes and winding paths.
3. The MicroVector system utilizes vectors to define the laser’s path, ensuring smoother cuts. The contours of the cover film cut by this laser are clean, round, smooth, with no burrs or glue overflow. In contrast, other methods such as punching with molds often result in burrs and glue overflow, which are difficult to remove after bonding and pressing, negatively impacting the final coating quality.
4. Flexible board sample processing frequently requires changes to the cover film window to accommodate modifications in wiring and pad positions. Traditional methods would necessitate replacing or modifying molds. However, with the MicroVector system, this issue is easily addressed by importing updated CAD data into the MicroVector software, allowing for quick and precise adjustments to the window shapes, saving both time and cost. This flexibility provides a competitive edge in the market.
5. The MicroVector system combines CNC technology, laser technology, software, and other advanced optomechanical systems. With high flexibility, precision, and speed, it equips circuit board manufacturers to adapt more efficiently and cost-effectively, transforming traditional flexible board processing and delivery methods.
6. **Applications:**
MicroVector UV laser equipment is applicable in several aspects of flexible board production, including FPC profile cutting, contour cutting, drilling, cover film opening, and more.
FPCs are primarily used in products such as laptops, mobile phones, LCMs, LCDs, PDAs, digital cameras, and many others.
**Features:**
Today’s flexible circuits (FPCs) are increasingly complex in shape and require faster turnaround times. Traditional flexible circuit processing methods, which involve machining techniques to create cover film windows and process the exterior, can no longer meet the demands of the market. These methods are cumbersome, costly for small to medium production runs, and the increasingly intricate shapes and sizes of openings make them difficult to process with molds. TopWin’s MicroVector equipment addresses these challenges by using high-power ultraviolet lasers for the processing of flexible circuit boards. This approach is suitable for both small batch and mass production, and has gained recognition in the market for its quality, cost-effectiveness, and speed.
1. Laser cutting directly from CAD data is more convenient and faster, significantly reducing delivery times.
2. By using a galvanometer scanner and a linear motor-driven two-dimensional worktable in combination, the system avoids added complexity from intricate shapes and winding paths.
3. The MicroVector system utilizes vectors to define the laser’s path, ensuring smoother cuts. The contours of the cover film cut by this laser are clean, round, smooth, with no burrs or glue overflow. In contrast, other methods such as punching with molds often result in burrs and glue overflow, which are difficult to remove after bonding and pressing, negatively impacting the final coating quality.
4. Flexible board sample processing frequently requires changes to the cover film window to accommodate modifications in wiring and pad positions. Traditional methods would necessitate replacing or modifying molds. However, with the MicroVector system, this issue is easily addressed by importing updated CAD data into the MicroVector software, allowing for quick and precise adjustments to the window shapes, saving both time and cost. This flexibility provides a competitive edge in the market.
5. The MicroVector system combines CNC technology, laser technology, software, and other advanced optomechanical systems. With high flexibility, precision, and speed, it equips circuit board manufacturers to adapt more efficiently and cost-effectively, transforming traditional flexible board processing and delivery methods.
6. **Applications:**
MicroVector UV laser equipment is applicable in several aspects of flexible board production, including FPC profile cutting, contour cutting, drilling, cover film opening, and more.
