S7038

HSD Materials, Mid-Loss Material

Characteristics

• Tg > 190°C (DSC)
• Dk/Df @ 1GHz: 3.62 / 0.0085
• Low Z-axis CTE with excellent processability

Application Areas

PC server, line card, HSD application…

Product Performance

Items	Method	Condition	Unit	Typical Value
Tg	IPC-TM-650 2.4.25	DSC	°C	190
Tg	IPC-TM-650 2.4.24.4	DMA	°C	200
Td	IPC-TM-650 2.4.24.6	5% wt. loss	°C	345
CTE (Z-axis) Before Tg	IPC-TM-650 2.4.24	Before Tg	ppm/°C	50
CTE (Z-axis) After Tg	IPC-TM-650 2.4.24	After Tg	ppm/°C	230
T260	IPC-TM-650 2.4.24.1	TMA	min	>60
T288	IPC-TM-650 2.4.24.1	TMA	min	27
Thermal Stress	IPC-TM-650 2.4.13.1	288°C, solder dip	—	PASS
Dissipation Constant (Dk) @ 1GHz	IPC-TM-650 2.5.5.9	1GHz	—	3.8
Dissipation Constant (Dk) @ 10GHz	IPC-TM-650 2.5.5.5	10GHz	—	3.62
Dissipation Factor (Df) @ 1GHz	IPC-TM-650 2.5.5.9	1GHz	—	0.0070
Dissipation Factor (Df) @ 10GHz	IPC-TM-650 2.5.5.5	10GHz	—	0.0085
Peel Strength (1oz RTF copper foil)	IPC-TM-650 2.4.8	After thermal stress 288°C, 10s	N/mm	1.1
Water Absorption	IPC-TM-650 2.6.2.1	E-1/105 + D-24/23	%	0.08
Flammability Rating	UL94	C-48/23/50	Rating	V-0
Flammability Rating	UL94	E-24/125	Rating	V-0

Remarks:

• 1. All typical values are based on a 0.76mm (6*2116) thickness specimen, but these are not guaranteed data.
• 2. All typical values listed above are for reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights reserved by Shengyi Technology Co., Ltd.

Explanation: C = Humidity conditioning, D = Immersion conditioning in distilled water, E = Temperature conditioning.

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in °C, and the third digit the relative humidity.

Data Download

• S7038 Line up
• S7038 Processing Guidelines
• S7038 Laminate SGS
• S7038 Prepreg SGS
• S7038 Laminate MSDS
• S7038 Prepreg MSDS
• S7038 TDS

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