PCB Layout Design Tips for 0.75mm Pitch BGA and 0.5mm Pitch BGA Memory Chip

When working on a PCB layout that includes a 0.75mm pitch BGA, it is essential to pay attention to the via size and solder mask expansion. For the via size, it is recommended to use a size that matches the pad size of the BGA for better connectivity and reliability. As for the solder mask expansion, a value of around 0.1mm to 0.15mm is commonly used to ensure proper coverage and protection.

Additionally, if you also have a 0.5mm pitch BGA memory chip on the same board, you may need to adjust the layout accordingly to accommodate the different pitch size. Make sure to follow the manufacturer’s recommendations for via size and solder mask expansion specific to the memory chip to optimize performance and reliability.