1. Sensor of SMT Placement Machine
Many are familiar with SMT placement machines, which are essential in the electronic assembly industry. These machines are categorized into boom, composite, rotary, and large-scale parallel systems. But how much do you know about the sensors in these machines? Let’s delve into that now.
1. Pressure Sensor: SMT placement machines, with their various cylinders and vacuum generators, require specific air pressure levels. If the pressure drops below these requirements, the machine will not operate correctly. The pressure sensor continuously monitors pressure changes and triggers an alarm if it detects any abnormalities, alerting the operator to take necessary action.
2. Negative Pressure Sensor: The suction nozzle of the placement machine relies on negative pressure to pick up components. This system includes a negative pressure generator (jet vacuum generator) and a vacuum sensor. Inadequate negative pressure can prevent component suction, whether due to a lack of components in the feeder or blockages in the material bag. The negative pressure sensor monitors these changes and triggers an alarm if the components cannot be picked up, prompting the operator to replace the feeder or check for blockages in the suction nozzle system.
3. **Position sensor**: The transmission and positioning of the printed board, including PCB counting, real-time detection of the placement head and worktable movement, and the movement of auxiliary mechanisms, have strict positional requirements. These positions must be monitored using various types of position sensors.
4. **Image sensor**: Real-time display of the placement machine’s working status primarily relies on CCD image sensors. These sensors collect necessary image signals, such as PCB position and device size, and use computer analysis to adjust the placement head and perform patch work.
2. **Matters needing attention in patch processing**
SMT (Surface Mount Technology) is a prevalent assembly technique in the electronics industry. SMT chip processing involves placing components on a PCB coated with glue or solder paste using placement equipment, followed by soldering in a furnace. This technology is favored for its high assembly density, compact electronic products, and excellent high-frequency characteristics. SMT placement machines enhance production efficiency and deliver high-quality products. These machines, akin to advanced automated robots, play a crucial role in production.
1. SMD RC components can first be tinned on one end of the solder joint. Place the component, clamp it with tweezers, and solder one end. Verify correct placement before soldering the other end.
2. Apply flux to the pad before soldering and process it with a soldering iron to prevent poor tinning or oxidation, which can result in inadequate soldering. Generally, the chip itself does not require additional processing.
3. When soldering all pins, add solder to the tip of the soldering iron and apply flux to keep the pins moist. Touch each pin with the iron tip until the solder flows into it. Ensure the soldering iron tip is parallel to the pin to avoid excess soldering.
4. Carefully place the PQFP chip on the PCB with tweezers. Avoid damaging the pins and ensure they are aligned with the pads. Verify the chip is oriented correctly.
5. After soldering all pins, use flux to clean the solder from the pins.
I hope this overview is helpful.
Many are familiar with SMT placement machines, which are essential in the electronic assembly industry. These machines are categorized into boom, composite, rotary, and large-scale parallel systems. But how much do you know about the sensors in these machines? Let’s delve into that now.
1. Pressure Sensor: SMT placement machines, with their various cylinders and vacuum generators, require specific air pressure levels. If the pressure drops below these requirements, the machine will not operate correctly. The pressure sensor continuously monitors pressure changes and triggers an alarm if it detects any abnormalities, alerting the operator to take necessary action.
2. Negative Pressure Sensor: The suction nozzle of the placement machine relies on negative pressure to pick up components. This system includes a negative pressure generator (jet vacuum generator) and a vacuum sensor. Inadequate negative pressure can prevent component suction, whether due to a lack of components in the feeder or blockages in the material bag. The negative pressure sensor monitors these changes and triggers an alarm if the components cannot be picked up, prompting the operator to replace the feeder or check for blockages in the suction nozzle system.
3. **Position sensor**: The transmission and positioning of the printed board, including PCB counting, real-time detection of the placement head and worktable movement, and the movement of auxiliary mechanisms, have strict positional requirements. These positions must be monitored using various types of position sensors.
4. **Image sensor**: Real-time display of the placement machine’s working status primarily relies on CCD image sensors. These sensors collect necessary image signals, such as PCB position and device size, and use computer analysis to adjust the placement head and perform patch work.
2. **Matters needing attention in patch processing**
SMT (Surface Mount Technology) is a prevalent assembly technique in the electronics industry. SMT chip processing involves placing components on a PCB coated with glue or solder paste using placement equipment, followed by soldering in a furnace. This technology is favored for its high assembly density, compact electronic products, and excellent high-frequency characteristics. SMT placement machines enhance production efficiency and deliver high-quality products. These machines, akin to advanced automated robots, play a crucial role in production.
1. SMD RC components can first be tinned on one end of the solder joint. Place the component, clamp it with tweezers, and solder one end. Verify correct placement before soldering the other end.
2. Apply flux to the pad before soldering and process it with a soldering iron to prevent poor tinning or oxidation, which can result in inadequate soldering. Generally, the chip itself does not require additional processing.
3. When soldering all pins, add solder to the tip of the soldering iron and apply flux to keep the pins moist. Touch each pin with the iron tip until the solder flows into it. Ensure the soldering iron tip is parallel to the pin to avoid excess soldering.
4. Carefully place the PQFP chip on the PCB with tweezers. Avoid damaging the pins and ensure they are aligned with the pads. Verify the chip is oriented correctly.
5. After soldering all pins, use flux to clean the solder from the pins.
I hope this overview is helpful.
