Issues with MG Chemicals Tin Plating Solution on DIY PCBs

Are you facing problems with the MG Chemicals tin plating solution on your DIY PCBs? It seems that the flux in your solder paste is causing the tin to erode during soldering, exposing bare copper around the soldered components. This can make the surface difficult to solder to, even with additional flux, due to oxidation.

The flux you are using is a synthetic no-clean flux. While you have ordered other pastes to test, you might be looking for alternative solutions. Have you considered applying a thicker layer of tin? However, since immersion tin is not autocatalytic, achieving a thicker plating may pose a challenge.

Alternatively, you mentioned that HASL (Hot Air Solder Leveling) looks intriguing. However, detailed resources on the levelling process, especially crucial for SMD (Surface Mount Device) applications, are scarce. If you have any suggestions or insights on tackling this issue, your input would be greatly appreciated.