On a small front panel to be manufactured as a PCB, I want to use white silkscreen over exposed copper. (Or rather exposed tin, to be precise — the copper will be tinned via HASL.) This is purely for cosmetic effect: I am looking for a white surface with a logo showing as an exposed tin pattern. 
I don’t want to put solder mask below the silkscreen in that area, because the alignment won’t be perfect in production: Even if I define the same logo pattern in the solder mask layer, I would still expect to get unwanted fringes of solder mask showing on one side of the logo.
I am aware that board houses will typically clip the silkscreen in areas without solder mask. I intend to ask them not to clip the silkscreen for this board; this has worked before, in a case where I wanted silkscreen on bare FR4.
My concern is: Will the silkscreen adhere properly (reasonably well?) to the exposed metal? Has anyone actually tried this — intentionally or accidentally — and can comment on how durable the silkscreen was?
Thanks!