Methods for Removing Tin in Circuit Board Processing
- Direct Hot Air Gun Blow:
- Tin Suction Device Disassembly Method:
- Medical Hollow Needle Disassembly Method:
- Electric Soldering Iron Brush Cooperative Disassembly Method:
The most direct and fastest method involves using a hot air gun to heat the solder around the IC block pins and then gently prying the block off with a thin needle or blade.
This professional method utilizes a solder sucker and a 35W+ electric soldering iron to melt and remove solder joints from the integrated block pins.
By using medical hollow needles of 8 to 12 gauge to cover the pins of the integrated block, solder can be melted with a soldering iron, and the needle can be used to separate the pins from the board.
This simple method involves heating an electric soldering iron, melting the solder on the pins, and wiping it off with a small brush to detach the integrated block from the circuit board.
Latest Updates:
In recent developments, some advanced PCB processing techniques have emerged, such as laser desoldering systems and selective soldering robots. These technologies offer more precise and efficient ways to remove tin from circuit boards, reducing the risk of damage and improving overall productivity.
