SMT production facilities are equipped with a range of essential machinery to facilitate the manufacture of surface mount technology (SMT) chips. By selecting the appropriate equipment, manufacturers can efficiently and effectively maximize production capacity and minimize waste.
Equipment and Process Overview:

1. Solder Paste Printing:

• For PCBs with only resistors, capacitors, and larger packaged chips, a syringe or automatic dispensing equipment may be used for solder paste coating without requiring a template. For PCBs containing smaller packaged chips, templates below 0805 are necessary.

1. Solder Paste Printing Equipment:

• Equipment such as solder paste printing machine and screen printing machine are used for printing solder paste or patch glue onto the PCB pads.

1. Component Placement:

• The accurate installation of surface mount components on the PCB is carried out using a placement machine (automatic, semi-automatic, or manual), as well as vacuum suction pens or tweezers.

1. Reflow Soldering:

• The solder paste is melted, securely brazing the surface mount components to the PCB. This process is achieved through the use of a reflow oven (automatic infrared/hot air reflow oven).

1. Cleaning and Inspection:

• Post-reflow, the PCB is cleaned to remove any substances that may affect electrical performance or solder residues. The assembly quality is then checked using X-ray inspection equipment, real-time imaging, or other relevant methods.

1. Rework:

• In the case of PCB failure, rework tools such as intelligent soldering irons and rework workstations are employed to rectify any detected issues.
  Conclusion:
  The SMT chip processing journey, though intricate, yields a reduction in the volume and weight of electronic products, with heightened reliability and robust anti-vibration capabilities. The evolution of SMT chip processing technology continues to drive prosperity in the electronics industry.