1. Dispensing Method for SMT Patch Processing
Dispensing Method for SMT Patch Processing: Dispensing involves using compressed air to apply red glue onto the substrate through a specialized dispensing head. The size and number of bonding points are controlled by parameters such as time, pressure, and the diameter of the dispensing tube. The glue dispenser offers flexible functionality; different glue heads can be used for various parts, parameters can be adjusted, and the shape and number of glue dots can be modified to achieve the desired effect. The advantages include convenience, flexibility, and stability. However, it is prone to issues like wire drawing and air bubbles. To minimize these defects, operating parameters such as speed, time, air pressure, and temperature can be adjusted.
The needle-rolling method of patch processing involves immersing a specialized needle-like film in a shallow rubber plate. Each needle has a joint, and when the glue dot contacts the substrate, it detaches from the needle. The amount of glue can be adjusted based on the shape and diameter of the needle. Curing conditions are as follows: temperature options are 100°C, 120°C, or 150°C, with curing times of 5 minutes, 150 seconds, or 60 seconds respectively. Typical curing conditions include:
1. Higher curing temperatures result in longer curing times and stronger bonding strength.
2. Since the temperature of the PCB adhesive can vary based on the size and placement of the substrate assembly, it is recommended to determine the most suitable curing conditions.
Red glue storage: Store at room temperature for up to 7 days; below 5°C for more than 6 months; and between 5-25°C for optimal conditions.
The size and volume of patch components used in SMT (Surface-Mount Technology) are significantly smaller compared to traditional through-hole components, typically reducing their dimensions by 60%-70% or even up to 90%. Additionally, their weight is reduced by 60%-90%. This reduction supports the increasing demand for miniaturization in electronic products. SMT components are usually lead-free or have short leads, which minimizes circuit parasitics and reduces radio frequency interference.
### Calculating the Cost of SMT Patch Processing
SMT chip processing is extensively used in the electronics manufacturing industry. However, the specific pricing of chip processing and the methods for cost calculation remain unfamiliar to many. Unlike finished product pricing, chip processing involves a more complex pricing structure influenced by various factors. This article will explain the calculation method for SMT chip processing costs.
Currently, the primary SMT processes include lead-free soldering, lead soldering, and red glue soldering. While the calculation methods for these processes are quite similar, many users are not well-versed in patch point calculations and cost estimation.
Some companies count each pad as one point, with two welds considered as a single point. This article uses pad counting as an example. You need to calculate the number of pads on the printed circuit board (PCB). For special components like inductors, large capacitors, or integrated circuits, you should calculate based on their rated power. For example, if an inductor counts as 10 points and a 40-pin integrated circuit is discounted to 20 points, you can estimate the total number of solder joints on the PCB accordingly.
**PCB Solder Joint Unit Price:** The current unit price for solder joints ranges from 0.008 to 0.03 yuan per joint, depending on the following factors:
1. **Process Type**
– a. The processing price for chip lead solder paste is lower.
– b. The cost of chip lead solder paste processing is relatively higher.
– c. Environmentally friendly SMD red glue solder paste processing costs less.
– d. Red glue patch solder paste with additional costs makes the process more complex.
2. **Order Quantity**
– a. For 3-20 ordinary SMT chips, the engineering fee is not calculated by multiplying the number of points by the unit price.
– b. For small-batch SMT chip processing of fewer than 1,000 pieces, a startup fee is multiplied by the unit price.
– c. For batch placement processing, costs are calculated by multiplying the number of points by the unit price.
3. **Board Difficulty**
– a. Single-sided and double-sided classifications: Single-sided patch processing is faster, while double-sided processing requires two passes, increasing costs.
– b. Precision: Higher precision chip processing, such as BGA and other high-density integrated circuit boards, is more expensive.
– c. Placement Component Density: More densely packed components on the same-sized PCB increase efficiency, shorten the placement machine’s coordinate stroke, and speed up processing.
4. **Startup Fee**
– For single batch processing orders under 1,000 yuan, it is considered a small batch order. For small batch SMT chip processing, after counting the points, the board component type, chip machine debugging time, and startup fee range from 400 to 2,000 yuan depending on the complexity.
5. **Proofing Fee**
– For SMT patch processing orders up to 100 sheets, the proofing cost varies based on board difficulty, program setup time, and startup requirements, ranging from 800 to 3,000 yuan.
6. **Wire Mesh Fee**
– Wire mesh costs depend on PCB size and the type of mesh used. Electrolytic polished steel mesh or ordinary steel mesh may be chosen based on the PCB’s accuracy requirements. Costs for different types of mesh range from 120 to 350 yuan, although customers can also supply their own mesh.
Dispensing Method for SMT Patch Processing: Dispensing involves using compressed air to apply red glue onto the substrate through a specialized dispensing head. The size and number of bonding points are controlled by parameters such as time, pressure, and the diameter of the dispensing tube. The glue dispenser offers flexible functionality; different glue heads can be used for various parts, parameters can be adjusted, and the shape and number of glue dots can be modified to achieve the desired effect. The advantages include convenience, flexibility, and stability. However, it is prone to issues like wire drawing and air bubbles. To minimize these defects, operating parameters such as speed, time, air pressure, and temperature can be adjusted.
The needle-rolling method of patch processing involves immersing a specialized needle-like film in a shallow rubber plate. Each needle has a joint, and when the glue dot contacts the substrate, it detaches from the needle. The amount of glue can be adjusted based on the shape and diameter of the needle. Curing conditions are as follows: temperature options are 100°C, 120°C, or 150°C, with curing times of 5 minutes, 150 seconds, or 60 seconds respectively. Typical curing conditions include:
1. Higher curing temperatures result in longer curing times and stronger bonding strength.
2. Since the temperature of the PCB adhesive can vary based on the size and placement of the substrate assembly, it is recommended to determine the most suitable curing conditions.
Red glue storage: Store at room temperature for up to 7 days; below 5°C for more than 6 months; and between 5-25°C for optimal conditions.
The size and volume of patch components used in SMT (Surface-Mount Technology) are significantly smaller compared to traditional through-hole components, typically reducing their dimensions by 60%-70% or even up to 90%. Additionally, their weight is reduced by 60%-90%. This reduction supports the increasing demand for miniaturization in electronic products. SMT components are usually lead-free or have short leads, which minimizes circuit parasitics and reduces radio frequency interference.
### Calculating the Cost of SMT Patch Processing
SMT chip processing is extensively used in the electronics manufacturing industry. However, the specific pricing of chip processing and the methods for cost calculation remain unfamiliar to many. Unlike finished product pricing, chip processing involves a more complex pricing structure influenced by various factors. This article will explain the calculation method for SMT chip processing costs.
Currently, the primary SMT processes include lead-free soldering, lead soldering, and red glue soldering. While the calculation methods for these processes are quite similar, many users are not well-versed in patch point calculations and cost estimation.
Some companies count each pad as one point, with two welds considered as a single point. This article uses pad counting as an example. You need to calculate the number of pads on the printed circuit board (PCB). For special components like inductors, large capacitors, or integrated circuits, you should calculate based on their rated power. For example, if an inductor counts as 10 points and a 40-pin integrated circuit is discounted to 20 points, you can estimate the total number of solder joints on the PCB accordingly.
**PCB Solder Joint Unit Price:** The current unit price for solder joints ranges from 0.008 to 0.03 yuan per joint, depending on the following factors:
1. **Process Type**
– a. The processing price for chip lead solder paste is lower.
– b. The cost of chip lead solder paste processing is relatively higher.
– c. Environmentally friendly SMD red glue solder paste processing costs less.
– d. Red glue patch solder paste with additional costs makes the process more complex.
2. **Order Quantity**
– a. For 3-20 ordinary SMT chips, the engineering fee is not calculated by multiplying the number of points by the unit price.
– b. For small-batch SMT chip processing of fewer than 1,000 pieces, a startup fee is multiplied by the unit price.
– c. For batch placement processing, costs are calculated by multiplying the number of points by the unit price.
3. **Board Difficulty**
– a. Single-sided and double-sided classifications: Single-sided patch processing is faster, while double-sided processing requires two passes, increasing costs.
– b. Precision: Higher precision chip processing, such as BGA and other high-density integrated circuit boards, is more expensive.
– c. Placement Component Density: More densely packed components on the same-sized PCB increase efficiency, shorten the placement machine’s coordinate stroke, and speed up processing.
4. **Startup Fee**
– For single batch processing orders under 1,000 yuan, it is considered a small batch order. For small batch SMT chip processing, after counting the points, the board component type, chip machine debugging time, and startup fee range from 400 to 2,000 yuan depending on the complexity.
5. **Proofing Fee**
– For SMT patch processing orders up to 100 sheets, the proofing cost varies based on board difficulty, program setup time, and startup requirements, ranging from 800 to 3,000 yuan.
6. **Wire Mesh Fee**
– Wire mesh costs depend on PCB size and the type of mesh used. Electrolytic polished steel mesh or ordinary steel mesh may be chosen based on the PCB’s accuracy requirements. Costs for different types of mesh range from 120 to 350 yuan, although customers can also supply their own mesh.
