The second solder mask process in PCB board production is the development stage.
The development process is typically conducted in a developing machine, with precise control over parameters such as the temperature of the developing solution, conveyor speed, and spray pressure to achieve optimal results.
Developing involves removing the solder mask from the pad using a 1% anhydrous sodium carbonate developing solution. The liquid temperature is typically maintained between 30 and 35 degrees Celsius. Prior to actual development, the machine temperature should be adjusted to reach the desired temperature for the solution, ensuring the best development outcome.
The developing machine comprises three stages:
– The first stage involves spraying, utilizing high-pressure injection of anhydrous sodium carbonate to dissolve the unexposed solder resist.
– The second stage is water washing, where a high-pressure pump is used to rinse the residual solution with water before thorough washing with circulating water.
– The third stage is drying, with hot air from air machines used to dry the board. Higher temperatures in the drying stage can expedite the drying process.
The correct development time is crucial, determined by the development point’s position within the developing section’s length. Maintaining a consistent percentage within 40%-60% of the total length is essential to prevent incomplete development or etching of the solder resist layer.
During development, precautions should be taken to prevent board scratching. Operators should wear gloves, handle boards gently, and arrange boards by size to avoid crowding during transmission. After development, boards should be placed on wooden brackets.
The development process is typically conducted in a developing machine, with precise control over parameters such as the temperature of the developing solution, conveyor speed, and spray pressure to achieve optimal results.
Developing involves removing the solder mask from the pad using a 1% anhydrous sodium carbonate developing solution. The liquid temperature is typically maintained between 30 and 35 degrees Celsius. Prior to actual development, the machine temperature should be adjusted to reach the desired temperature for the solution, ensuring the best development outcome.
The developing machine comprises three stages:
– The first stage involves spraying, utilizing high-pressure injection of anhydrous sodium carbonate to dissolve the unexposed solder resist.
– The second stage is water washing, where a high-pressure pump is used to rinse the residual solution with water before thorough washing with circulating water.
– The third stage is drying, with hot air from air machines used to dry the board. Higher temperatures in the drying stage can expedite the drying process.
The correct development time is crucial, determined by the development point’s position within the developing section’s length. Maintaining a consistent percentage within 40%-60% of the total length is essential to prevent incomplete development or etching of the solder resist layer.
During development, precautions should be taken to prevent board scratching. Operators should wear gloves, handle boards gently, and arrange boards by size to avoid crowding during transmission. After development, boards should be placed on wooden brackets.
