In the layout of flexible circuit boards (FCBs), the size plays a crucial role. When the board is excessively large, soldering becomes more manageable. However, elongated printed lines lead to increased impedance, reduced anti-noise capability, and heightened costs. Conversely, if the board is too small, heat dissipation diminishes, soldering control becomes challenging, and frequent occurrences of adjacent line interference, such as electromagnetic interference, arise. Hence, optimizing PCB design is imperative:

(1) Minimize wiring length between high-frequency components to mitigate EMI interference.

(2) Secure heavy-weight components (exceeding 20g) with brackets before soldering.

(3) Address heat dissipation concerns for heated components to avert defects and rework due to significant ΔT on component surfaces. Keep thermal components distant from heat sources.

(4) Arrange components in parallel alignment for a neat appearance, ease of soldering, and suitability for mass production. Maintain a 4:3 rectangular board shape for optimal performance. Avoid altering wire widths to prevent wiring discontinuities. Prolonged heating of the board may cause copper foil swelling and detachment; hence, refrain from using extensive copper foil areas.

As a leading FPC manufacturer, WellCircuits Limited is proud of our collaborations with many esteemed clients. We stand prepared to assist new customers in any capacity. Please feel free to reach out to us with any inquiries.

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