Soldering Flexible Circuit Boards: A Comprehensive Approach

1. Preparation for Soldering:
   • Apply flux to the pad before soldering to prevent poor tin plating or pad oxidation.
   • Use a soldering iron to process the pad; typically, the chip does not require pre-processing.
2. Chip Placement:
   • Carefully place the PQFP chip on the PCB, ensuring alignment and correct orientation.
   • Adjust soldering iron temperature to 300°C, add a small amount of solder to diagonal pins to fix the chip in place.
3. Soldering All Pins:
   • Apply flux to all pins to maintain moisture during soldering.
   • Touch the tip of the soldering iron to each pin until solder flows into the pin.
   • Keep the iron parallel to prevent excessive soldering and overlap.
4. Cleaning and Inspection:
   • Wet all pins with flux after soldering; remove excess solder to prevent short circuits.
   • Check for false soldering using tweezers.
   • Clean the board with alcohol-soaked brush along the pin direction.
5. Soldering SMD RC Components:
   • Apply tin to a solder joint, place one end of the component, and align with tweezers.
   • Confirm alignment before soldering the other end.

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