1. PCB Circuit Part:
1. Disconnection
A. There is a break or discontinuity in the line.
B. The length of the broken segment exceeds 10mm and cannot be repaired.
C. The disconnection occurs near the PAD or the edge of the hole. (If the open circuit is less than or equal to 2mm from the PAD or edge, it can be repaired; however, if it is greater than 2mm from either, it cannot be repaired.)
D. Adjacent lines are disconnected side by side and cannot be repaired.
E. The line gap is broken at a bend; (if the distance from the break to the bend is less than or equal to 2mm, it can be repaired. If the bend at the break is greater than 2mm, it cannot be repaired.)
2. PCB Short Circuit
A. A short circuit caused by foreign matter between two wires can be repaired.
B. An internal short circuit cannot be repaired.
3. Line Gap
A. The line gap is less than 20% of the original line width and can be repaired.
4. Line Depression & Indentation
A. If the line is uneven, pressing it down can allow for repairs.
5. Wiring Tin
A. The circuit has been tin-dipped (if the total tin-dipped area is less than or equal to 30 square millimeters, it can be repaired; if the area exceeds 30 square millimeters, it cannot be repaired).
Here’s the revised article with slight rephrasing while maintaining clarity and technical accuracy:
6. Poor Circuit Repair
A. The compensation line’s offset or specifications do not match the original dimensions (acceptable if it does not affect minimum width or spacing).
7. Exposed Copper
A. The solder mask on the circuit has peeled off and can be repaired.
8. Crooked Line
A. The distance is less than the original or there are notches, which can be repaired.
9. Line Stripping
A. Peeling has occurred between copper layers, which cannot be repaired.
10. Insufficient PCB Line Spacing
A. Reducing the distance between two lines by more than 30% is not possible; repairable if within 30%.
11. Residual Copper
A. The distance between two lines cannot be reduced by more than 30% and is repairable.
B. If reduced by more than 30%, it cannot be repaired.
12. Line Contamination and Oxidation
A. Oxidation or contamination has caused discoloration, which cannot be repaired.
13. Scratched Line
A. If the wire exposes copper due to scratches, it can be repaired; otherwise, it won’t be considered scratched.
14. Thin Line
A. Line width below 20% of specified width cannot be repaired.
2. PCB Solder Mask Issues:
1. Color Difference (standard: upper and lower levels)
A. Surface ink color differs from standard; compare with the color difference chart to determine acceptability.
2. Anti-Weld Cavitation
3. Anti-Weld Exposed Copper
A. Exposed copper due to peeling green paint can be repaired.
4. Anti-Weld Scratches
A. If scratches expose copper or substrate, it can be repaired.
5. Solder-Resistant ON PAD
A. Staining on tin pads, BGA pads, and ICT pads cannot be repaired.
6. Poor Repair: If the green paint area is excessive or the repair is incomplete, lengths over 30mm, areas exceeding 10 square mm, or diameters greater than 7 square mm are unacceptable.
7. Foreign Matter
A. Presence of foreign objects in the solder mask interlayer is repairable.
8. Uneven Ink
A. Ink accumulation or unevenness affects appearance; minor accumulation does not require maintenance.
9. BGA VIA Hole Not Inked
A. BGA requires 100% ink filling.
10. CARD BUS VIA HOLE Not Filled
A. The VIA HOLE at CARD BUS CONNECTOR needs to be completely plugged, checked under backlight.
11. VIA HOLE Not Plugged
A. VIA HOLE requires 95% filling; inspection under backlight.
12. Tin Dip: No more than 30 square millimeters.
13. False Exposed Copper; repairable.
14. Wrong Ink Color; not repairable.
3. Through Hole Issues:
1. Hole Plug
A. Foreign matter blocking the part hole cannot be repaired.
2. Broken Hole
A. A broken ring hole prevents connection and cannot be repaired.
B. Dotted holes are also not repairable.
3. Green Paint in Part Hole
A. Part holes covered by solder resist and white paint residues cannot be repaired.
4. NPTH with Tin Dip
A. Converting NPTH holes into PTH can be repaired.
5. Multi-Hole Locks cannot be repaired.
6. Leaking Holes cannot be repaired.
7. Misaligned Holes off the PAD cannot be repaired.
8. Hole Size Discrepancies
A. Large and small holes exceeding specification error values are not repairable.
9. BGA VIA HOLE Plug Issues are not repairable.
4. PCB Text Issues:
1. Text Offset, Overdrawn to Tin Pad; not repairable.
2. Text Color Mismatch or Incorrect Printing.
3. Text Ghosting can be repaired if still identifiable.
4. Missing Text is not repairable.
5. Text Ink Stains on Board Surface can be repaired.
6. Unclear Text affects recognition; repairable.
7. Off Text due to tensile testing with 3M600 tape can be repaired.
5. PCB Pad Issues:
1. Tin Pad Gap due to scratches or other factors can be repaired.
2. Gap in BGA PAD cannot be repaired.
3. Poor Optical Dots and alignment issues cannot be repaired.
4. Uneven BGA Tin Spraying and excessive thickness cannot be repaired.
5. Missing Optical Dots cannot be repaired.
6. PAD Falling Off can be repaired.
7. Uninked QFP cannot be repaired.
8. Acceptable loss of QFP ink is limited to less than 3 strips; otherwise, it cannot be repaired.
9. Oxidation and discoloration on PAD can be repaired.
10. Exposed Copper on BGA or QFP PAD cannot be repaired.
11. PAD Stained with White Paint or Solder Resist Ink can be repaired.
6. Other Issues:
1. PCB Sandwich Separation with white spots is not repairable.
2. Weave Pattern Exposure: If greater than or equal to 10 square millimeters, it is not repairable.
3. Contaminated Board Surface: No dust, fingerprints, oil, or external pollution; repairable.
4. Incorrect Molding Size cannot be repaired.
5. Poor Cutting or Incomplete Forming cannot be repaired.
6. Thin Board Thickness exceeding specifications cannot be repaired.
7. Warped Board Height greater than 1.6mm cannot be repaired.
8. Molding Burrs and uneven edges can be repaired.
