Wellcircuits, a leading manufacturer of high-complexity HDI PCBs, excels in the development and production of HDI PCBs with FR4 materials exceeding 5 layers, as well as high-speed and high-frequency materials. In addition to these, the company also specializes in producing advanced products, including PCBs with ultra-high layer counts and high-frequency capabilities.
Next, let’s explore the details of Wellcircuits’ latest 22-layer, 4-order Rogers high-frequency HDI PCB with pure lamination and an ultra-high aspect ratio.
Stack-Up and Parameter Overview
• 22-Layer HDI PCB Stack-Up
• Parameter Overview
Number of Layers: 22
Board Thickness: 6.9mm
Minimum Hole Diameter: 0.45mm
Number of Laminations: 5
Via Process: Resin-filled vias
Aspect Ratio: 15:1
Impedance: 50Ω ± 3Ω
Trace Width/Spacing: 4mil/4mil
BGA Diameter: 8mil (16 groups), each group corresponds to 12 RF traces
Application Fields and Frequency Bands
• Application Fields: 5G Base Stations
• Frequency Bands: 26GHz