Wellcircuits, a leading manufacturer of high-complexity HDI PCBs, excels in the development and production of HDI PCBs with FR4 materials exceeding 5 layers, as well as high-speed and high-frequency materials. In addition to these, the company also specializes in producing advanced products, including PCBs with ultra-high layer counts and high-frequency capabilities.

Next, let’s explore the details of Wellcircuits’ latest 22-layer, 4-order Rogers high-frequency HDI PCB with pure lamination and an ultra-high aspect ratio.

Stack-Up and Parameter Overview

22-Layer HDI PCB Stack-Up

Parameter Overview

Number of Layers: 22

Board Thickness: 6.9mm

Minimum Hole Diameter: 0.45mm

Number of Laminations: 5

Via Process: Resin-filled vias

Aspect Ratio: 15:1

Impedance: 50Ω ± 3Ω

Trace Width/Spacing: 4mil/4mil

BGA Diameter: 8mil (16 groups), each group corresponds to 12 RF traces

Application Fields and Frequency Bands

• Application Fields: 5G Base Stations

• Frequency Bands: 26GHz

Product Photos

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