**Summary of PCB Board Drawing Technology:**

(1): When creating the schematic diagram, it’s essential to use network labels (NET) for pin labeling instead of text labels (TEXT). Failure to do so may lead to issues during PCB design guidance.

(2): All components in the schematic must be properly packaged; otherwise, they won’t be recognized during the PCB guidance process. Some PCB components may not be available in the library, requiring me to create them manually. I continue to draw them myself, resulting in a personal library that enhances convenience. The drawing process begins with FILE/NEW—”Select SCH LIB—” which takes you to the part editing library. After drawing, click TOOLS-RENAME COMPONENT to rename the component.

The component package image resembles this one, but ensure the PCB LIB is selected. The component’s border should be on the TOPOverlay layer, depicted in yellow.


(3): After completing the drawing, rename the components sequentially. Then, select the TOOLS menu and choose “ANNOTATE” to annotate the components in order.

(4): Prior to converting to PCB, generate a report, primarily the netlist. Go to the DESIGN menu and select “Create Netlist” to generate the netlist.

(5): Additionally, it is crucial to check the electrical rules. Navigate to TOOLS and select ERC.

(6): The PCB can then be generated. If any errors occur during the generation process, the schematic must be corrected before regenerating the PCB.

(7): A well-planned layout is essential for the PCB. Keep the traces as short as possible and minimize the number of vias.

(8): Before routing, set the design rules: go to TOOLS and select Design Rules. Adjust the Clearance Constraint for Routing, selecting either 10 or 12. The vias should be configured in ROUTING VIA STYLE, with the maximum outer diameter being the smallest size. Specify the largest and smallest inner diameters. The Width Constraint will define the trace width, including maximum and minimum values.

(9): Typically, the trace width is set to 12 MIL. Peripheral power and ground traces should be 120 or 100 MIL, while chip power and ground traces should be 50, 40, or 30 MIL. Crystal traces should be thicker and placed close to the microcontroller. Power and ground lines should also be thick, and long-distance traces should maintain this thickness. Avoid right-angle turns; use 45-degree angles instead. Mark power, ground, and other critical signals on the TOPLAY to facilitate connection debugging. If any discrepancies are found in the schematic, correct it first, then update the PCB accordingly.

(10): The bottom option in the VIEW menu allows you to choose between inches or millimeters.

(11): To enhance the board’s resistance to interference, it’s best to apply copper at the end. Select the copper-plated icon, which will bring up a dialog box. In the dialog, select the connected network under Net Option, and check both options below it. For HATCHING STYLE, choose the type of copper coating; this is flexible. GRID SIZE determines the spacing of the copper grid points. Ensure that the TRACK WIDTH aligns with the PCB trace width we previously defined. Compare and select the LOCKPrimitives options, while the other two settings can follow the example shown in the figure.

This concludes the summary of PCB circuit board drawing techniques.
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