2. Consequently, the performance, quality, manufacturability, production level, cost efficiency, and long-term reliability and stability of PCBs largely depend on the materials used in the copper clad laminate.
3. CCL technology and production have undergone more than half a century of evolution, and today, global annual production of CCL has surpassed 300 million square meters.
1. CCL has become an essential component of the basic materials in electronic information products.
2. The copper clad laminate manufacturing industry is a sunrise sector, with promising prospects linked to the growth of electronic information and communication industries.
3. Its manufacturing technology represents a high-tech domain that intersects and integrates multiple disciplines.
4. The historical development of electronic information technology highlights that copper clad laminate technology is a key driver of the rapid advancement of the electronics industry.
5. The evolution of copper clad laminate technology and production is closely intertwined with the electronic information industry, particularly the PCB sector.
6. This represents a continuous process of innovation and relentless pursuit of improvement.
7. The advancement of copper clad laminates is propelled by innovations in electronic products, semiconductor manufacturing technologies, electronic mounting technologies, and PCB manufacturing techniques.
8. The swift progress of the electronic information industry has enabled electronic products to trend towards miniaturization, functional enhancement, high performance, and exceptional reliability.
9. From the general surface mount technology (SMT) of the mid-1970s to the high-density interconnect surface mount technology (HDI) of the 1990s, as well as the emergence of new packaging technologies like semiconductor and IC packaging, electronic mounting technology is evolving towards higher densities.
10. Concurrently, the advancement of high-density interconnect technology is facilitating the evolution of PCBs toward increased density.
11. As mounting and PCB technologies progress, the technology of copper clad laminates used as PCB substrate materials is also undergoing constant enhancement.
12. Experts project that the global electronic information industry will experience an average annual growth rate of 7.4% over the next decade.
13. By 2010, the global electronic information market is expected to reach $3.4 trillion, with electronic complete machines accounting for $1.2 trillion and communication equipment and computers comprising over 70% of this total, amounting to $0.86 trillion.
14. Thus, the substantial market for copper clad laminates as foundational electronic materials is not only expected to persist but also to grow at an impressive rate of 15%.
15. Information released by the Copper Clad Laminate Industry Association indicates that over the next five years, to align with trends in high-density BGA technology and semiconductor packaging, the share of high-performance thin FR-4 and high-performance resin substrates will increase.
