The tin dipping effect in PCB welding involves hot solder forming intermetallic bonds with copper, influenced by surface cleanliness and temperature, while the resulting metal alloy’s properties depend on the welding conditions and the thickness of the alloy layer.
The text explains various factors affecting PCB soldering, including the tin-dipping effect for metal bonding, surface tension impacts on solder behavior, the importance of metal alloy grain structure, and evaluating solderability through meniscus formation.
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