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Characteristics of PCB Manufacturing Processes

The PCB industry is evolving with technologies like reflow and selective soldering, which offer cost-effective solutions for soldering through-hole components while addressing challenges like temperature sensitivity and oxidation, with selective soldering providing precise, efficient methods for complex, small-scale soldering tasks.

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How to measure metal thickness in PCB design?

PCB coating thickness can be measured using two main methods: the non-destructive β backscattering method, which is fast and accurate, and the destructive microsection method, which provides detailed but time-consuming results.

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Technology-Driven Approach to PCBA Quality Control

PCBs are essential to all electronic devices, and as their design capabilities advance, rigorous quality assurance testing becomes crucial to ensure high-quality production, minimize defects, and avoid disruptions in manufacturing and supply chains.

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Understand the three types of drilling processes in PCB fabrication.

PCB drilling includes through holes, blind holes, and buried holes, with vias serving as electrical connections between layers, where blind and buried vias optimize space and conductivity, but are more complex and costly to manufacture.

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Gain a comprehensive understanding of the different PCB heat dissipation techniques.

Effective heat dissipation is crucial in PCB design to prevent overheating and ensure reliable performance, achieved through techniques like adding copper foil, thermal vias, and optimizing component placement to manage thermal load.

Gain a comprehensive understanding of the different PCB heat dissipation techniques. Read More »

What are the common defects found in FPC (Flexible Printed Circuit) boards?

Common issues in the screen printing process for FPC flexible circuit boards, such as bubble formation, pinholes, blackening, dirt, ghosting, cracking, and color inconsistencies, along with their causes and solutions.

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Process Specifications for PCB Fabrication

PCB processing requires a comprehensive understanding of various methods and materials, with strict adherence to procedures for handling, identification, and finishing to ensure high-quality, durable products while meeting environmental and industry standards.

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Arrangement of components on the PCB circuit board

When designing a PCB, closely place related components, strategically position decoupling capacitors, ensure effective ground wire layout, and minimize trace impedance to enhance circuit reliability and interference resistance.

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Methods for identifying and assessing failures in PCB assemblies.

This article outlines common PCB manufacturing faults, integrates circuit principles, and presents a comprehensive fault detection process, ultimately summarizing trends in PCB detection technologies.

Methods for identifying and assessing failures in PCB assemblies. Read More »

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