The process of PCB assembly involves various techniques, including single-sided and double-sided methods, with careful quality control and soldering practices essential to prevent issues like short circuits that can damage the board.
PCBA processes for various types of PCB circuit boards. Read More »
Pyrolysis technology is a promising and efficient method for recycling waste circuit boards, offering advantages like reduced energy consumption, but challenges remain in accurately analyzing bromine-containing compounds and preventing environmental pollution during the process.
Recycling of Waste PCBs via Pyrolysis Technology Read More »
The general PCB design process involves several stages, including preliminary preparation, structure design, layout, wiring optimization, inspections, and plate making, with an emphasis on creating precise component libraries and strategically placing components to optimize performance and production feasibility.
The integration of SMD on FPC is crucial for miniaturizing electronics, requiring careful process management for solder paste printing, placement, and welding to ensure high precision and reliability.
To understand the fundamental principles of FPC placement. Read More »
FPCs (flexible printed circuit boards) use polyimide for flexibility in compact spaces, while PCBs (rigid printed circuit boards) use FR4 for stability and flatness, each suited to different application needs in electronic designs.
The distinction between FPC (Flexible Printed Circuit) boards and rigid circuit boards. Read More »
The invention introduces a process for gold-cladding PCB board sides using nickel-gold electroplating, allowing simultaneous gold plating of both the top layer and sidewalls by exposing the copper surface through etching and applying a dry film.
Edge Metallization of PCB: Gold Finger Technology Read More »
As circuit board designs become more complex, existing power management architectures face challenges, leading to the emergence of a new distributed architecture that enhances performance, safety, and flexibility while reducing design workload and costs.
Power Management Architecture for CPLD PCB Design Read More »
The primary goal of PCB surface treatment is to ensure optimal solderability and electrical performance by preventing copper oxidation through various methods, including hot air leveling, organic solderability preservative, and different plating techniques.
PCB design is vital for power supply stability, affecting EMI; this article covers techniques for LED drive supplies, including workflow, spacing standards, component layout, wiring considerations, and a comprehensive checklist for design rules and configurations.
Skills and specifications for PCB circuit board design. Read More »
The PCBA process involves various inspection methods post-reflow soldering to ensure quality, including manual checks, automatic optical inspection, and X-ray analysis, with special techniques for through-hole components and wave soldering, ultimately ensuring functional integrity before final inspection.
Inspection control for PCBA during the insertion of through-hole components. Read More »
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We excel in rapid-turnaround PCB prototyping and thrive on handling challenging projects as our forte.