The article explains the PCB subtractive manufacturing process, detailing the types of printed circuit boards produced (single-sided, non-plated through-hole, and plated through-hole), their respective production methods, and the advantages and disadvantages of the subtractive technique in PCB design and manufacturing.
1. PCB processing special processes include Additive Method for localized conductor circuit growth, categorized into full, half, and partial addition; 2. Backpanels, also known as backplanes, facilitate interconnection with other boards via connector insertion without soldering, requiring stringent quality standards; 3. The Build Up Process, originating from IBM’s SLC method, enables fabrication of thin multi-layer boards through innovative techniques like photo-vias and sequential lamination, revolutionizing multi-layer board technology.
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
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