B. Thermal design recommends installing printed boards upright with a 2cm distance between boards, aligning devices based on cooling method, arranging devices by heat output, and considering airflow paths for optimal heat dissipation.
Heat dissipation techniques for PCB boards should consider the arrangement of devices based on their heat generation and dissipation capabilities, positioning high-power devices near the edge and top of the board, optimizing airflow paths, and distributing power evenly to prevent hot spots. WellCircuits Limited specializes in high-precision circuit boards catering to various customer needs.
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