alignment difficulties

Challenges in Prototyping Multilayer PCBs Production

Multi-layer PCB production faces challenges in inner circuit complexity, alignment between layers, pressing processes, and drilling production due to increasing requirements in various industries. Recommendations include designing wider line widths, ensuring even distribution of copper, and maintaining proper hole edge spacing.

Challenges in Prototyping Multilayer PCBs Production Read More »

Challenges in Prototyping Multilayer PCBs Production

Multi-layer PCB production faces challenges in inner circuit complexity, alignment between layers, pressing processes, and drilling production due to increasing requirements in various industries. Recommendations include designing wider line widths, ensuring even distribution of copper, and maintaining proper hole edge spacing.

Challenges in Prototyping Multilayer PCBs Production Read More »

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