With the advancement of technology, the size of PCBs is shrinking, making it challenging to accommodate numerous electronic components. The issue of test points taking up valuable PCB space is a point of contention between design and manufacturing teams. Needle bed testing has limitations, such as minimum probe diameter and spacing restrictions, as well as risks of contact short circuits and potential damage to taller components. Alternative testing methods are emerging, but none can fully replace ICT testing. Consultation with fixture manufacturers is advised to ensure proper probe diameter and spacing for ICT needle implantation.