anode passivation.

Challenges and Resolutions in PCB Nickel Plating

Problems and Solutions in PCB Nickel Plating include coating burn, low deposition rate, brittle coating, darkening of the coating, blistering or peeling, anode passivation, pinholes, and roughness. Solutions include adjusting boric acid levels, metal salt concentration, operating temperature, pH value, current density, improving stirring, activating copper plating layer, reducing contamination, and monitoring water quality.

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Challenges and Resolutions in PCB Nickel Plating

Problems and Solutions in PCB Nickel Plating include coating burn, low deposition rate, brittle coating, darkening of the coating, blistering or peeling, anode passivation, pinholes, and roughness. Solutions include adjusting boric acid levels, metal salt concentration, operating temperature, pH value, current density, improving stirring, activating copper plating layer, reducing contamination, and monitoring water quality.

Challenges and Resolutions in PCB Nickel Plating Read More »

Causes and Remediation of Defects in Electroplating Nickel Processes

The causes and elimination of faults in PCB electroplating nickel process include organic pollution leading to makeng and pinholes, roughness and burrs due to impurities, low adhesion from poor deoxidation, coating brittleness and poor weldability from organic and heavy metal pollution, uneven color and dark coating from metal pollution, coating burn from various factors, low deposition rate from low pH or current density, blistering or peeling from various factors, and anode passivation from insufficient anode activator and other factors.

Causes and Remediation of Defects in Electroplating Nickel Processes Read More »

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