Factors influencing SMT soldering reliability, including misalignment of solder resist and cover film, surface contamination of pads, deformation of reinforcement plates, and varied processing technologies, underscore the critical need for meticulous SMD/SMC pad design and rigorous FPCB manufacturing processes to achieve flawless SMT assembly.
To correct PCB copy board deformation, various methods include splicing, adjusting hole positions, overlapping pads, photography, and hanging the film to stabilize it, each suited to different types of deformation and requirements.
How to Address Deformation of Negative Films in PCB Board Processing Read More »
Right-angle routing in high-speed and RF PCB design can lead to impedance discontinuities and signal reflections, which impact performance, and should be minimized through chamfering or rounding corners to reduce such issues.
Why should sharp and right angles be avoided in PCB routing? Read More »
Characteristics and processing of halogen-free PCBs, focusing on their materials, flame-retardant properties, and production practices.
The definition of halogen-free PCBs or their benefits and applications? Read More »
High-speed PCB designs are advancing transmission rates but face challenges with declining anti-interference capability due to increased signal sensitivity and reduced energy, necessitating effective shielding against both low-frequency electromagnetic interference (EMI) and high-frequency radio frequency interference (RFI) to ensure signal integrity and prevent data interception.
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.