Automated Optical Inspection

Inner Layer Multi-Layer PCB Fabrication Process – 03 – PCB Production Details – Wellcircuits

Surface Pre-TreatmentThe copper sheet after cutting has oxides grease and other impurities attached to the surface which firstly needs to be pretreated The main purpose of pretreatment is to remove

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What is the purpose of test points on a PCB?

Test points on a PCB are necessary to safely and efficiently verify the functionality and solderability of components using automated test equipment, preventing damage to sensitive parts during the testing process.

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Techniques for Testing PCB Circuit Boards

The five main PCB testing methods—manual visual inspection, automated optical inspection (AOI), functional testing, in-circuit testing (ICT), and X-ray inspection—each offer distinct advantages and limitations for ensuring the quality, reliability, and performance of circuit boards in electronic manufacturing.

Techniques for Testing PCB Circuit Boards Read More »

Techniques for Testing PCB Circuit Boards

The five main PCB testing methods—manual visual inspection, automated optical inspection (AOI), functional testing, in-circuit testing (ICT), and X-ray inspection—each offer distinct advantages and limitations for ensuring the quality, reliability, and performance of circuit boards in electronic manufacturing.

Techniques for Testing PCB Circuit Boards Read More »

What is the function of AOI (Automated Optical Inspection) testing technology?

AOI (Automated Optical Inspection) is an advanced electronic testing technology used in PCB duplication, which helps detect defects during the production process by scanning PCBs and comparing them to predefined parameters, ensuring both end-product quality and process tracking across various stages such as solder paste printing, component placement, and reflow soldering.

What is the function of AOI (Automated Optical Inspection) testing technology? Read More »

Advantages and disadvantages of Automated Optical Inspection (AOI)

AOI systems have revolutionized SMT assembly by replacing manual inspections with imaging technology to detect component defects, though limitations persist despite advancements in detecting obscured regions and achieving a perfect inspection rate.

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