Special processing for PCB fabrication.
1. PCB processing special processes include Additive Method for localized conductor circuit growth, categorized into full, half, and partial addition; 2. Backpanels, also known as backplanes, facilitate interconnection with other boards via connector insertion without soldering, requiring stringent quality standards; 3. The Build Up Process, originating from IBM’s SLC method, enables fabrication of thin multi-layer boards through innovative techniques like photo-vias and sequential lamination, revolutionizing multi-layer board technology.