The maximum warpage of IPC-6012, SMB-SMT circuit boards is 0.75%, with other boards not exceeding 1.5%. The warpage allowed by electronic assembly factories is usually 0.70-0.75%, but some boards require less than 0.5%. Warpage prevention methods include proper prepreg arrangement, baking the board before cutting, and paying attention to warp and weft directions during lamination and cutting. Warped plates can be treated by hot pressing and baking.

The maximum warpage of IPC-6012, SMB-SMT circuit boards is 0.75%, with other boards not exceeding 1.5%. The warpage allowed by electronic assembly factories is usually 0.70-0.75%, but some boards require less than 0.5%. Warpage prevention methods include proper prepreg arrangement, baking the board before cutting, and paying attention to warp and weft directions during lamination and cutting. Warped plates can be treated by hot pressing and baking.