packaging principles and functional characteristics of commonly used ICs, aiding electronic engineers in precise IC selection for circuit design. It emphasizes the importance of understanding various IC packaging types for efficient factory batch production programming and matching IC package and burner models.
Summary of IC Packaging Principles and Functional Characteristics Read More »
Planning to buy SMT line, facing delays with installation, power upgrade, and business issues. Seeking advice on AOI, SPI, and AXI machines’ roles and suitable manufacturers for inspection equipment.
Seeking advice for using a hot air station for microsoldering small components. Asking for recommended temperature and airflow settings, and whether preheating the board is necessary.
The evolution of PCB surface treatment technology, influenced by environmental concerns and evolving industry standards, emphasizes lead-free and halogen-free processes like organic coating and electroless nickel plating/immersion gold, while also considering factors like component type and assembly requirements, leading to a dynamic landscape of options with a focus on meeting customer needs and environmental standards.
The emergence of Ball Grid Array (BGA) packaging, with solder balls replacing pins, revolutionizes electronic assembly, offering versatility and overcoming limitations of traditional packages like Quad Flat Packages (QFP), leading to derivative packages like Chip Scale Packaging (CSP). BGA assembly involves considerations such as pad design, solder paste printing, alignment accuracy, temperature profile, and defect prevention. Prioritizing CAD tracking feasibility and PCB manufacturability, BGA pad design aims to minimize soldering defects and accommodate future rework, with types like dog-bone pads requiring careful sizing to avoid manufacturing issues like solder bridging.
BGA placement accurate. Options for testing 400+ pins without high cost.
Can you provide any recommendations for examining FPGAs? Read More »
Questioning experience with cheap Chinese manufacturer for 0.8mm pitch BGA on PCB with 6/6 mil routes and 0.3mm drill. Difficulty routing tracks between 0.8mm pitch BGA pads, seeking advice on alternative solutions.
Several common integrated circuit packaging forms include SOP (Small Outline Package), PGA (Pin Grid Array Package), BGA (Ball Grid Array Package), and DIP (Dual In-Line Package). Each form serves different purposes and has unique characteristics to meet various production needs.
PCB layout with 0.75mm pitch BGA and 0.5mm pitch BGA memory chip.
Selecting via sizes for a 0.75 pitch on a 541-pin BGA Read More »
During BGA soldering, FR4 PCB manufacturers may experience issues such as voids, short circuits, and deformation due to temperature differences, which can be mitigated through proper heating slopes, preheating, and design improvements.
Causes of concurrent solder voiding and short circuiting in FR4 PCBs with BGAs Read More »
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