BGA components

Factors Impacting the Quality of BGA Patch Assembly

The accuracy of BGA component installation on a circuit board is crucial and can be achieved through precise chip placement machines, coplanarity checks, and appropriate temperature profiles, with inspection methods like AOI and AXI testing ensuring soldering reliability and joint quality. Effective electrostatic protection measures are also necessary during the BGA assembly process.

Factors Impacting the Quality of BGA Patch Assembly Read More »

Factors Influencing the Quality of BGA Soldering Assembly

BGA pads’ type and solder mask position impact soldering; SMD offers larger bonding area but prone to cracking, while NSMD aids tracking but weakens bonding strength; selection depends on technical considerations; solder paste printing precision crucial for quality soldering.

Factors Influencing the Quality of BGA Soldering Assembly Read More »

Contact

WellCircuits
More than PCB

Upload your GerberFile(7z,rar,zip)