BGA on flex PCB
BGA, or Ball Grid Array, is a packaging technology developed to meet the demand for compact, high-performance electronics by providing high-density, cost-effective solutions for integrated circuit chips.
BGA packaging
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Operating from China, WellCircuits stands as a top-tier manufacturer of premium PCBs & PCBAs.
Our expertise lies in crafting multilayer flexible circuits, rigid-flex PCBs, HDI PCBs, and Rogers PCBs.
We excel in rapid-turnaround PCB prototyping and thrive on handling challenging projects as our forte.