The PCBA welding and heating process requires precise temperature control and thermal design to avoid soldering defects like tombstoning, BGA joint failure, and QFP pin openings, with key strategies including the use of heat sink pads and optimized reflow profiles to ensure uniform heat distribution and reliable connections.
Thermal Design Considerations and Characteristics of PCBA Read More »
In PCB manufacturing, Design Rule Check (DRC) ensures the design meets electrical and layout standards, while Design for Manufacturability (DFM) evaluates the design’s feasibility for production; both are essential steps, with DRC addressing design integrity and DFM focusing on manufacturing compatibility, complemented by X-ray inspection to verify the quality of hidden BGA solder joints in the assembly.
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.