The rapid advancement of electronic technology has led to increasing challenges in PCB soldering, particularly false soldering, which can result in product defects that go undetected during testing, potentially damaging a brand’s reputation and causing financial losses.
False soldering and improper soldering in DIP plug-in and PCB assembly Read More »
The article discusses the challenges and quality issues associated with placing vias on BGA solder pads in PCB designs, highlighting how this practice can lead to defects like voids and inadequate soldering, while exploring alternative designs and their impact on manufacturing.
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