PCB drilling includes through holes, blind holes, and buried holes, with vias serving as electrical connections between layers, where blind and buried vias optimize space and conductivity, but are more complex and costly to manufacture.
Understand the three types of drilling processes in PCB fabrication. Read More »
Circuit boards are made up of layers of copper foil circuits connected by vias, including Plating Through Holes (PTH), Blind Via Holes (BVH), and Buried Via Holes (BVH), with different methods and costs for conducting electricity and maximizing space utilization in PCB prototyping.
Cadence Allegro has almost become the industrial standard in high-speed PCB board design, and attention should be paid to routing high-frequency PCB signals, improving the electrical performance of the board, adding decoupling capacitors strategically, ensuring reasonable layout, minimizing the use of blind holes for signals, dividing electric layers, and considering serpentine routing for high-speed signals.
PCB drilling is a crucial process in PCB manufacturing, involving through hole, blind hole, and buried hole drilling, which are essential for connecting circuits in different layers of the board and ensuring the board’s usability and functionality.
Three commonly used types of PCB drilling techniques Read More »
With the rapid development of the electronic industry, PCBs are evolving towards high density and precision, with different types of drilling holes emerging to meet production needs, such as through holes, blind holes, and buried holes. In high-speed PCB design, efforts can be made to reduce the adverse effects of parasitic effects caused by vias, such as choosing reasonable via hole sizes, using thinner PCB boards, minimizing unnecessary vias, and optimizing the placement of power and ground vias.
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