PCB multi-substrate design closely resembles single or dual-substrate designs, emphasizing the importance of avoiding overly dense circuit layouts to prevent issues with tolerances, inner layer capacity, and product safety; thus, performance evaluations should consider thermal shock, insulation resistance, and solderability, among other critical factors.
The cost of PCB manufacturing varies based on plate materials, board thickness, copper and dielectric layer thickness, raw material suppliers, process standards, and surface treatments, with customizations and process complexities affecting overall pricing.
What are the primary factors influencing PCB pricing? Read More »
Rigid-flex PCB stack-ups integrate rigid and flexible layers, offering advantages like fewer solder joints and connectors, minimal board thickness, high thermal strength, and a high aspect ratio for optimized signal transmission and wiring, enhancing durability, flexibility, and space efficiency.
PCB board thickness is an important consideration for ensuring the performance and reliability of the PCB, and it is determined by factors such as application requirements, copper thickness, substrate material, number of PCB layers, signal type, type of through-hole, and operating conditions.
What is the process for selecting the suitable thickness for a PCB board? Read More »
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.