Insufficient bonding forces between PCB coatings can lead to separation and quality issues during production, influenced by factors such as substrate processing, surface treatment, micro-etching control, and contamination.
Factors Leading to Defective PCB Surfaces and Recommended Repair Procedures Read More »
Surface foaming in PCBA circuit board assembly is primarily caused by poor binding force, influenced by surface cleanliness and microscopic roughness. Challenges in coating stress endurance lead to separation, exacerbated by inadequate substrate removal and thin inner layer problems. Control over brushing processes and meticulous attention to production control are crucial to prevent issues. Foaming may vary depending on equipment technology, necessitating case-specific analysis. WellCircuits Limited prioritizes quality with advanced equipment and strict adherence to quality standards, aiming to be a responsible enterprise.
The electrochemical copper-free process includes a preprocessing step to ensure the integrity of the electroless copper deposition layer, the bonding force between chemical copper and the base copper foil, the bonding force between chemical copper and inner copper foil, and the bonding force between the electroless copper layer and the non-conductive substrate. This preprocessing step includes degreasing to remove oil, grease, dirt, and contamination from the copper foil and the hole, and the washing step after degreasing is as important as the degreasing.
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Operating from China, WellCircuits stands as a top-tier manufacturer of premium PCBs & PCBAs.
Our expertise lies in crafting multilayer flexible circuits, rigid-flex PCBs, HDI PCBs, and Rogers PCBs.
We excel in rapid-turnaround PCB prototyping and thrive on handling challenging projects as our forte.