The poor plating during PCB electroplating is caused by various factors such as pinholes, pitting, airflow streaks, exposure, brittle coating, air pocket, tin flower, climbing tin, whisker tin, and orange peel-like coating.
Description and Causes of Inadequate Plating in Electroplating Read More »
Problems and Solutions in PCB Nickel Plating include coating burn, low deposition rate, brittle coating, darkening of the coating, blistering or peeling, anode passivation, pinholes, and roughness. Solutions include adjusting boric acid levels, metal salt concentration, operating temperature, pH value, current density, improving stirring, activating copper plating layer, reducing contamination, and monitoring water quality.
Challenges and Resolutions in PCB Nickel Plating Read More »
The poor plating during PCB electroplating is caused by various factors such as pinholes, pitting, airflow streaks, exposure, brittle coating, air pocket, tin flower, climbing tin, whisker tin, and orange peel-like coating.
Description and Causes of Inadequate Plating in Electroplating Read More »
Problems and Solutions in PCB Nickel Plating include coating burn, low deposition rate, brittle coating, darkening of the coating, blistering or peeling, anode passivation, pinholes, and roughness. Solutions include adjusting boric acid levels, metal salt concentration, operating temperature, pH value, current density, improving stirring, activating copper plating layer, reducing contamination, and monitoring water quality.
Challenges and Resolutions in PCB Nickel Plating Read More »
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