In PCB design, vias are essential for layer-to-layer connections and component positioning, with types including **blind**, **buried**, and **through** vias, each affecting manufacturing cost, performance, and design complexity, with through vias being the most commonly used due to their cost-effectiveness and ease of integration.
Via design expertise in PCB (Printed Circuit Board) layout and design. Read More »
HDI (High-Density Interconnect) PCBs use advanced techniques like blind and buried vias to enable compact, high-performance circuit boards, crucial for modern electronics, especially in miniaturized, high-density applications.
Distinguishing PCB Designs: HDI Boards vs. Blind and Buried Via Boards Read More »
The article discusses the Sequential Lamination Method for producing buried/blind-via multilayer PCBs, emphasizing the technical challenges and requirements for CAD wiring, inner layer production, lamination, and outer layer graphic production, while highlighting the need for cost-effective solutions for SMEs with limited capital investment in specialized equipment.
Layering Technology for Blind and Buried Via PCB Lamination Read More »
The drilling process in PCB manufacturing creates via holes—through, blind, and buried vias—that connect different layers of the circuit board, enabling electrical communication, while the via hole plugging process ensures proper filling to meet customer specifications and improve production quality.
Three types of drilled holes for printed circuit boards Read More »
Vias are essential components in PCB design, with different types (blind, buried, and through) impacting signal integrity, electrical performance, and current-carrying capacity, and minimizing vias is crucial for high-speed and high-frequency circuits to ensure proper impedance matching and reduce signal interference.
Complex challenges associated with PCB design and manufacturing. Read More »
Significance of HDI (High-Density Interconnect) circuit boards in modern electronics, emphasizing their use of micro-blind via technology to enhance circuit density and performance while addressing challenges in manufacturing alignment, glue flow, and graphic transfer.
Key steps in transferring PCB schematics to layout include grid setup, defining blank areas and vias, adjusting pad/via parameters, establishing design rules, customizing shortcut keys, managing schematic errors, synchronizing design updates with annotation, renumbering devices, and handling last-minute changes effectively.
Regarding the transition from PCB schematic to layout Read More »
PCB vias, including blind, buried, and through vias, serve crucial roles in multilayer circuit boards, each tailored to specific design and functionality needs, optimizing space and performance.
Types of multilayer PCB vias: Through-hole, blind, buried, micro, and filled vias Read More »
HDI technology enables denser PCB designs, facilitating smaller boards with increased component density and shorter interconnect paths, crucial for advancing multifunctional electronic products.
Circuit Board Manufacturer in China Introduces HDI Boards Read More »
HDI PCBs are widely used in digital devices such as smartphones and tablets for compact design and improved electrical performance, while also crucial in medical devices like implants and emergency room monitors requiring high-speed signal transmission and miniaturization.
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.